3

®

OPA655

Internal Power Dissipation ........................... See Thermal Considerations

Common-Mode Input Voltage Range ..................................................

±V

S

Storage Temperature Range: P, U ............................... –40

°C to +125°C

Lead Temperature (soldering, 10s) .............................................. +300

°C

(soldering, SO-8, 3s) ...................................... +260

°C

ABSOLUTE MAXIMUM RATINGS

PIN CONFIGURATION

PACKAGE DRAWING

PRODUCT

PACKAGE

OPA655P

8-Pin Plastic DIP

006

OPA655U

SO-8

182

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix C of Burr-Brown IC Data Book.

PACKAGE INFORMATION

Top View

DIP/SO-8

PRODUCT

PACKAGE

TEMPERATURE RANGE

OPA655P

8-Pin Plastic DIP

–40

°C to +85°C

OPA655U

SO-8

–40

°C to +85°C

ORDERING INFORMATION

ELECTROSTATIC

DISCHARGE SENSITIVITY

Electrostatic discharge can cause damage ranging from per-

formance degradation to complete device failure. Burr-Brown

Corporation recommends that all integrated circuits be handled

and stored using appropriate ESD protection methods.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric

changes could cause the device not to meet published speci-

fications.

NOTE: (1) Making use of all four power supply pins is highly recommended,

although not required. Using these four pins, instead of pins 4 and 7 only, will

reduce the effective pin impedance and substantially improve distortion.

1

2

3

4

8

7

6

5

+V

S2

(1)

+V

S1

Output

–V

S2

(1)

NC

Inverting Input

Non-Inverting Input

–V

S1