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TPS3824-33DBVRG4 Datasheet(PDF) 5 Page - Texas Instruments |
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TPS3824-33DBVRG4 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 29 page TPS3820, TPS3823, TPS3823A, TPS3824, TPS3825, TPS3828 www.ti.com SLVS165K – APRIL 1998 – REVISED NOVEMBER 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating junction temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VDD –0.3 6 Voltage V RESET, RESET, MR, WDI –0.3 (VDD + 0.3) Maximum low output, IOL –5 5 Current Maximum high output, IOH –5 5 mA Output range (VO < 0 or VO > VDD), IOK –10 10 Continuous total power dissipation See Thermal Information Operating free-air, TA –40 85 Temperature °C Storage, Tstg –65 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to GND. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101, ±500 all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted). MIN NOM MAX UNIT VDD Supply voltage 1.1 5.5 V VIH High-level input voltage at MR and WDI 0.7 × VDD V VIL Low-level input voltage 0.3 × VDD V Δt/ΔV Input transition rise and fall rate at MR or WDI 100 ns/V TA Operating free-air temperature range –40 85 °C 7.4 Thermal Information TPS382x THERMAL METRIC(1) DBV (SOT-23) UNIT 5 PINS RθJA Junction-to-ambient thermal resistance 209.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 72.8 °C/W RθJB Junction-to-board thermal resistance 36.7 °C/W ψJT Junction-to-top characterization parameter 2.1 °C/W ψJB Junction-to-board characterization parameter 35.8 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 1998–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TPS3820 TPS3823 TPS3824 TPS3825 TPS3828 |
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