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BZX55C22 Datasheet(PDF) 7 Page - Formosa MS |
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BZX55C22 Datasheet(HTML) 7 Page - Formosa MS |
7 / 8 page Page 7 Formosa MS BZX55C2V4 THRU BZX55C100 Document ID Issued Date Revised Date Revision Page. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Zener Diode BULK PACKING DO-35G 2,000 96 * 80 * 42 410 * 335 * 265 120,000 17.4 DEVICE CASE TYPE Q'TY 1 (PCS / BOX) INNER BOX SIZE CARTON SIZE Q'TY 2 (PCS / CARTON) APPROX. CROSS WEIGHT(kg) (m/m) (m/m) Suggested thermal profiles for soldering processes 1.Lead free temperature profile wave-soldering 0 20 40 60 80 100 120 140 160 180 200 220 240 Time(Sec) 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 Preheat Max gradient 2ºC/s Peak Max well time 5 Max Cool Down Max gradient-4ºC/s Suggested gradient 2ºC/s or less - Peak soldering temperature not to exceed 260ºC DS-222713 2008/02/10 2010/03/10 B 8 |
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Similar Description - BZX55C22 |
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