Package outline

Page 2

3.0W Surface Mount Zener

Diodes - 6.8V-200V

PARAMETER

CONDITIONS

Symbol

V

F

P

D

MIN.

TYP.

MAX.

1.20

3.0

UNIT

V

W

Storage temperature range

Operating junction temperature range

T

STG

T

J

-55

-65

+150

+175

A

o

Forward voltage

Power dissipation

I = 200 mA

F

Formosa MS

Chip Zener Diode

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Mechanical data

Epoxy:UL94-V0 rated flame retardant

Case : Molded plastic,

Terminals : Solder plated, solderable per

MIL-STD-750, Method 2026

Polarity : Indicated by cathode band

Mounting Position : Any

Weight :

0.09 gram

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DO-214AA / SMB

Approximated

0.213(5.4)

0.197(5.0)

0.016(0.4) Typ.

0.142(3.6)

0.126(3.2)

0.075(1.9)

0.067(1.7)

0.032 (0.8) Typ.

0.032(0.8) Typ.

Dimensions in inches and (millimeters)

SMB

Batch process design, excellent power dissipation offers

better reverse leakage current and thermal resistance.

Glass passivated chip junction.

Standard zener voltage tolerance ±5%.

Low inductance.

Low profile package.

Built-in strain relief.

Lead-free parts meet environmental standards of

MIL-STD-19500 /228

Features

Suffix "-H" indicates Halogen-free part, ex.ZGFM306V8B-H.

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Document ID

Issued Date

Revised Date

Revision

Page.

ZGFM306V8B THRU ZGFM30200B

T=50 C

L

°

Thermal Characteristics

PARAMETER

Symbol

UNIT

Limit

°C/W

Typical thermal resistance junction to ambient

R

θJA

85

DS-121741

2009/08/10

2011/07/01

D

9

Note

1 Mounted on FR-4 PCB

：.