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Z30-130B Datasheet(PDF) 7 Page - Formosa MS |
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Z30-130B Datasheet(HTML) 7 Page - Formosa MS |
7 / 7 page Page 7 Document ID Issued Date Revised Date Revision Page. Formosa MS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Zener Diode Z30-11B THRU Z30-330B High reliability test capabilities 1. Solder Resistance 2. Solderability 3. Pull Test 4. Bend Lead 5. High Temperature Reverse Bias 6. Pressure Cooker 7. Temperature Cycling 8. Thermal Shock 9. Humidity 10. High Temperature Storage Life at 260±5 for 10±2sec. immerse body into solder 1/16"±1/32" o at 245±5 C for 5 sec. 1kg in axial lead direction for 10 sec. 1kg weight applied to each lead bending o o arc 90 ±5 for 3 times. o V =80% rate at T =150 C for 168 hrs. R J o 15P at T =121 C for 4 hrs. SIG A o o -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. o o 0 C for 5 min. rise to 100 C for 5 min. total 10 cycles. o at T =85 C, RH=85% for 1000hrs. A o at 175 C for 1000 hrs. oC MIL-STD-750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-2036 MIL-STD-750D METHOD-2036 MIL-STD-750D METHOD-1038 JESD22-A102 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-1056 MIL-STD-750D METHOD-1021 MIL-STD-750D METHOD-1031 Item Test Conditions Reference DS-222719 2008/02/10 2010/03/10 B 7 |
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