OPA843

2

SBOS268C

www.ti.com

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

DESIGNATOR

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

OPA843

SO-8

D

–40

°C to +85°C

OPA843

OPA843ID

Rails, 100

"

"""

"

OPA843IDR

Tape and Reel, 2500

OPA843

SOT23-5

DBV

–40

°C to +85°C

OARI

OPA843IDBVT

Tape and Reel, 250

"

"""

"

OPA843IDBVR

Tape and Reel, 3000

NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.

Power Supply ...............................................................................

±6.5V

DC

Internal Power Dissipation ...................................... See Thermal Analysis

Differential Input Voltage ..................................................................

±1.2V

Input Voltage Range ............................................................................

±V

S

Storage Voltage Range: D, DBV ................................... –65

°C to +125°C

Lead Temperature (soldering, 10s) ............................................... +300

°C

ESD Rating (Human Body Model) .................................................. 2000V

(Charge Device Model) ............................................... 1500V

(Machine Model) ........................................................... 200V

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degrada-

tion to complete device failure. Precision integrated circuits

may be more susceptible to damage because very small

parametric changes could cause the device not to meet its

published specifications.

NOTE: (1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods may degrade

device reliability. These are stress ratings only, and functional operation of the

device at these or any other conditions beyond those specified is not implied.

PIN CONFIGURATIONS

Top View

SO

Top View

SOT

1

2

3

4

8

7

6

5

NC

+V

S

Output

NC

NC = No Connection

NC

Inverting Input

Noninverting Input

–V

S

1

2

3

5

4

+V

S

Inverting Input

Output

–V

S

Noninverting Input

OARI

Pin Orientation/Package Marking