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Absolute Maximum Ratings

(1)

Recommended Operating Conditions

Package Dissipation Ratings

(1) (2)

TPS54311-EP, TPS54312-EP,

TPS54313-EP, TPS54314-EP,

TPS54315-EP, TPS54316-EP

SGLS376A – FEBRUARY 2007 – REVISED MARCH 2007

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN, SS/ENA, FSEL

–0.3

7

RT

–0.3

6

Input voltage range

V

VSENSE

–0.3

4

BOOT

–0.3

17

VBIAS, PWRGD, COMP

–0.3

7

Output voltage range

V

PH

–0.6

10

PH

Internally Limited

Source current

COMP, VBIAS

6

mA

PH

6

A

Sink current

COMP

6

mA

SS/ENA,PWRGD

10

mA

Voltage differential

AGND to PGND

±0.3

V

Operating virtual junction temperature range

–55

150

°C

Storage temperature

–65

150

°C

Lead temperature 1,6 mm (1/16 in) from case for 10 s

300

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

MIN

NOM

MAX

UNIT

Input voltage range

3

6

V

Operating junction temperature

–55

125

°C

THERMAL IMPEDANCE

PACKAGE

JUNCTION-TO-AMBIENT

POWER RATING

POWER RATING

POWER RATING

20-Pin PWP with solder

26

°C/W

2.12 W

1.54 W

20-Pin PWP without solder

57.5

°C/W

1.73 W

0.96 W

0.69 W

(1)

For more information on the PWP package, see the Texas Instruments technical brief (SLMA002).

(2)

Test board conditions:

a.

3 in

× 3 in, 2 layers, Thickness: 0.062 in

b.

1.5 oz copper traces located on the top of the PCB

c.

1.5 oz copper ground plane on the bottom of PCB

d.

Ten thermal vias (see the recommended land pattern in the Applications section of this data sheet)

(3)

Maximum power dissipation may be limited by overcurrent protection.

4

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