TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT

FLOATINGPOINT DIGITAL SIGNAL PROCESSOR

KNOWN GOOD DIES

SGUS024C − MARCH 1997 − REVISED OCTOBER 2001

3

POST OFFICE BOX 1443

description (continued)

The simulation tools include:

verification (HV) model and a full functional (FF) model

The hardware development and verification tools include:

communication port connections

For additional information when designing for cold temperature operation, please see Texas Instruments

application report 320C3x, 320C4x and 320MCM42x Power-up Sensitivity at Cold Temperature, literature

number SGUA001.

known good die technology

Known good die (KGD) options are offered for use in multichip modules and chip-on-board (COB) applications.

There are currently two verification technologies used at TI to support KGD requirements for the

TMP/SMJ320C40KGD: Removable Tab (R-Tab), and Temporary Wire Bond (TWB).

The availability of selected DSP products in a tape-automated bond (TAB) configuration has made possible the

use of a removable TAB technique. The TAB leadframe is attached to a gold-bumped die using modified bonding

parameters. This technique allows easy removal of the tape after all needed 100% screens and parametric tests

have been performed. The tape is removed from the tested part and the die is shipped in a conventional die

container. The gold bumps remain on the bond pads, which allow for subsequent attachment of gold-ball bonds.

Similarly, with KGD using the TWB technique, bond wires are attached to the bond pads using adjusted bonding

parameters which allow for easy removal of the die after all needed 100% screens and parametric tests have

been performed. The die is removed from the temporary package and the die is shipped in a conventional die

container.

visual inspection of known good die (KGD) using temporary wire bond (TWB) process

QML KGD devices produced using the TWB technology do not optically meet MIL-STD-883E (Method 2010,

paragraph 3.1.1.1.h) metal bond pad visual inspection criterion due to the bond pad marks formed during

bonding removal process. However, these devices have been reliably bonded using normal wire bond

precesses, and pass bond strength evaluations.

electrical specifications

For military electrical and timing specifications, please refer to the SMJ320C40 Digital Signal Processor data

sheet, literature number SGUS017. For commercial electrical and timing specifications, see the TMS320C40

Digital Signal Processor Data Sheet, literature number SPRS038.

XDS510 is a trademark of Texas Instruments Incorporated.