Electronic Components Datasheet Search |
|
TPS54361-Q1 Datasheet(PDF) 4 Page - Texas Instruments |
|
|
TPS54361-Q1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 50 page TPS54361-Q1 SLVSCC4A – APRIL 2014 – REVISED APRIL 2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN –0.3 65 EN –0.3 8.4 BOOT 73 FB –0.3 3 Input voltage V COMP –0.3 3 PWRGD –0.3 6 SS/TR –0.3 3 RT/CLK –0.3 3.6 BOOT-SW 8 Output voltage SW –0.6 65 V SW, 10-ns Transient –2 65 Operating junction temperature –40 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM), per AEC Q100-002(1) –2 2 kV Corner pins (1, 5, V(ESD) Electrostatic discharge –750 750 6, and 10) Charged device model (CDM), per AEC-Q100-011 V Other pins –500 500 (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V(VIN) Supply input voltage 4.5 60 V VO Output voltage 0.8 58.8 V IO Output current 0 3.5 A TJ Junction Temperature –40 150 °C 7.4 Thermal Information DPR THERMAL METRIC(1)(2) UNIT (10 PINS) RθJA Junction-to-ambient thermal resistance (standard board) 35.1 ψJT Junction-to-top characterization parameter 0.3 ψJB Junction-to-board characterization parameter 12.5 °C/W RθJCtop Junction-to-case(top) thermal resistance 34.1 RθJCbot Junction-to-case(bottom) thermal resistance 2.2 RθJB Junction-to-board thermal resistance 12.3 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) Power rating at a specific ambient temperature TA must be determined with a junction temperature of 150°C. This is the point where distortion starts to substantially increase. See the power dissipation estimate in the Power Dissipation Estimate section of this data sheet for more information. 4 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: TPS54361-Q1 |
Similar Part No. - TPS54361-Q1 |
|
Similar Description - TPS54361-Q1 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |