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TPS54394 Datasheet(PDF) 2 Page - Texas Instruments |
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TPS54394 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 28 page TPS54394 SLVSBE6B – JUNE 2012 – REVISED AUGUST 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION(1) TA PACKAGE(2) (3) ORDERING PART NUMBER PINS OUTPUT SUPPLY TPS54394PWPR Tape-and-Reel PWP 16 TPS54394PWP Tube –40 ℃ to 85℃ TPS54394RSAR RSA 16 Tape-and-Reel TPS54394RSAT (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (3) All packaging options have Cu NIPDAU lead/ball finish. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) (2) VALUE UNIT MIN MAX VIN1, VIN2, EN1, EN2 –0.3 20 VBST1, VBST2 –0.3 26 VBST1, VBST2 (10ns transient) –0.3 28 Input voltage range VBST1–SW1 , VBST2–SW2 –0.3 6.5 V VFB1, VFB2 –0.3 6.5 SW1, SW2 –2 20 SW1, SW2 (10ns transient) –4.5 22 VREG5, PG1, PG2 –0.3 6.5 Output voltage range V PGND1, PGND2 –0.3 0.3 Human Body Model (HBM) 2 kV Electrostatic discharge Charged Device Model (CDM) 500 V TA Operating ambient temperature range –40 85 °C TSTG Storage temperature range –55 150 °C TJ Junction temperature range –40 150 °C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" are not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to IC GND terminal. THERMAL INFORMATION TPS54394 THERMAL METRIC(1) UNITS PWP (16) PINS RSA (16) PINS θJA Junction-to-ambient thermal resistance 41.4 32.8 θJCtop Junction-to-case (top) thermal resistance 27.1 35.4 θJB Junction-to-board thermal resistance 20.8 9.9 °C/W ψJT Junction-to-top characterization parameter 1.0 0.4 ψJB Junction-to-board characterization parameter 20.6 10.0 θJCbot Junction-to-case (bottom) thermal resistance 2.7 1.6 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links :TPS54394 |
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