3

Exposed

Thermal Pad

9

10

11

12

8

7

6

5

4

2

1

16

15

14

13

PVIN

PVIN

AVIN

SS/TR

SW

SW

SW

PG

4

TPS62150, TPS62150A, TPS62151, TPS62152, TPS62153

SLVSAL5D – NOVEMBER 2011 – REVISED SEPTEMBER 2016

www.ti.com

Product Folder Links: TPS62150 TPS62150A TPS62151 TPS62152 TPS62153

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Copyright © 2011–2016, Texas Instruments Incorporated

5 Device Comparison Table

PART NUMBER

OUTPUT VOLTAGE

Power Good Logic Level (EN=Low)

TPS62150

adjustable

High Impedance

TPS62150A

adjustable

Low

TPS62151

1.8 V

High Impedance

TPS62152

3.3 V

High Impedance

TPS62153

5.0 V

High Impedance

(1)

For more information about connecting pins, see the Detailed Description and Application and Implementation sections.

(2)

(3)

An internal pull-down resistor keeps logic level low, if pin is floating.

6 Pin Configuration and Functions

RGT Package

16-Pin VQFN With Thermal Pad

Top View

Pin Functions

I/O

DESCRIPTION

NO.

NAME

1,2,3

SW

O

Switch node, which is connected to the internal MOSFET switches. Connect inductor between SW and

output capacitor.

4

PG

O

pull-up resistor)

5

FB

I

Voltage feedback of adjustable version. Connect resistive voltage divider to this pin. It is recommended

to connect FB to AGND on fixed output voltage versions for improved thermal performance.

6

AGND

Analog Ground. Must be connected directly to the Exposed Thermal Pad and common ground plane.

7

FSW

I

Switching Frequency Select (Low

8

DEF

I

9

SS/TR

I

Soft-Start / Tracking Pin. An external capacitor connected to this pin sets the internal voltage reference

rise time. It can be used for tracking and sequencing.

10

AVIN

I

Supply voltage for control circuitry. Connect to same source as PVIN.

11,12

PVIN

I

Supply voltage for power stage. Connect to same source as AVIN.

13

EN

I

14

VOS

I

Output voltage sense pin and connection for the control loop circuitry.

15,16

PGND

Power Ground. Must be connected directly to the Exposed Thermal Pad and common ground plane.

Exposed

Thermal Pad

Must be connected to AGND (pin 6), PGND (pin 15,16) and common ground plane. See the Layout

Example. Must be soldered to achieve appropriate power dissipation and mechanical reliability.