AL5809Q

Document number: DS38233 Rev. 1 - 2

3 of 12

www.diodes.com

March 2016

© Diodes Incorporated

AL5809Q

Package Thermal Data

Package

Thermal Resistance

Junction-to-Case

Thermal Resistance

Junction-to-Ambient

PowerDI123 (Type B)

27.15°C/W

148.6°C/W (Note 5)

0.84W

PowerDI123 (Type B)

17.81°C/W

81.4°C/W (Note 6)

1.53W

Symbol

Parameter

Min

Max

Unit

“In” Voltage Range Relative to “Out” Pin

2.5

60

V

LED Current (Note 7)

15

150

mA

Operating Junction Temperature Range (Note 8)

-40

+150

°C

Operating Ambient Temperature Range (Note 8)

-40

+85

°C

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

In-Out Supply Voltage

—

2.5



60

V

(±5% for Overtemperature)

AL5809-15QP1-7

14.25

15

15.75

mA

AL5809-20QP1-7

19

20

21

AL5809-25QP1-7

23.75

25

26.25

AL5809-30QP1-7

28.5

30

31.5

AL5809-40QP1-7

38

40

42

AL5809-50QP1-7

47.5

50

52.5

AL5809-60QP1-7

57

60

63

AL5809-90QP1-7

85.5

90

94.5

AL5809-100QP1-7

95

100

105

AL5809-120QP1-7

114

120

126

AL5809-150QP1-7

142.5

150

157.5

(Note 10)



1



%/V

Minimum Power Up Voltage

1

1.5

2

V

Thermal Shutdown Junction

Temperature







+165



°C

Thermal Shutdown Hysteresis







+30



°C

Notes:

5. Test condition for PowerDI123 (Type B): Device mounted on 25.4mm x 25.4mm FR-4 PCB (10mm x 10mm 1oz copper, minimum recommended pad

layout on top layer and thermal vias to bottom layer ground plane). For better thermal performance, larger copper pad for heatsink is needed.

6. When mounted on 50.8mm x 50.8mm GETEK PCB with 25.4mm x 25.4mm copper pads.

7. The LED operating current is determined by the AL5809Q current option index XXX, AL5809Q-XXXP1-7.

8. The Maximum ambient temperature range is limited by device power dissipation; such that its junction temperature should be kept less than or equal to

+150°C. See Page 5 for more information on power dissipation. Devices have been qualified to AEC-Q100 Grade 3.

9. All voltages unless otherwise stated are measured with respect to the Out Pin.

11. Apply the power linearly to the chip until the device starts to turn on.