Electronic Components Datasheet Search |
|
TPS61175QPWPRQ1 Datasheet(PDF) 3 Page - Texas Instruments |
|
|
TPS61175QPWPRQ1 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 30 page 1 2 3 4 5 6 7 14 13 12 11 10 9 8 SW SW VIN EN SS SYNC AGND PGND PGND PGND NC FREQ FB COMP 3 TPS61175-Q1 www.ti.com SLVSCN9A – DECEMBER 2014 – REVISED APRIL 2016 Product Folder Links: TPS61175-Q1 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated 6 Pin Configuration and Functions TSSOP 14-PIN (TOP VIEW) Pin Functions PIN I/O DESCRIPTION NAME NO. VIN 3 I The input supply pin for the IC. Connect VIN to a supply voltage between 2.9 V and 18 V. It is acceptable for the voltage on the pin to be different from the boost power stage input for applications requiring voltage beyond VIN range. SW 1,2 I This is the switching node of the IC. Connect SW to the switched side of the indu1ctor. FB 9 I Feedback pin for positive voltage regulation. Connect to the center tap of a resistor divider to program the output voltage. EN 4 I Enable pin. When the voltage of this pin falls below the enable threshold for more than 10 ms, the IC turns off. COMP 8 O Output of the internal transconductance error amplifier. An external RC network is connected to this pin to compensate the regulator. SS 5 O Soft start programming pin. A capacitor between the SS pin and GND pin programs soft start timing. See application section for information on how to size the SS capacitor. FREQ 10 O Switch frequency program pin. An external resistor is connected to this pin to set switch frequency. See application section for information on how to size the FREQ resistor. AGND 7 I Signal ground of the IC PGND 12,13,14 I Power ground of the IC. It is connected to the source of the PWM switch. SYNC 6 I Switch frequency synchronous pin. Customers can use an external signal to set the IC switch frequency between 200-kHz and 2.2-MHz. If not used, this pin should be tied to AGND as short as possbile to avoid noise coupling. NC 11 I Reserved pin. Must connect this pin to ground. Thermal Pad The thermal pad should be soldered to the analog ground. If possible, use thermal via to connect to top and internal ground plane layers for ideal power dissipation. |
Similar Part No. - TPS61175QPWPRQ1 |
|
Similar Description - TPS61175QPWPRQ1 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |