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TPS62095 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS62095 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 27 page TPS62095 SLVSBD8A – APRIL 2014 – REVISED MAY 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) MIN MAX UNIT Voltage at pins(2) PVIN, AVIN, FB, SS, EN, DEF, VOS -0.3 7.0 V SW, PG -0.3 VIN+0.3 Sink current PG 1.0 mA Operating junction -40 150 °C temperature (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground pin. 6.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 0 2000 pins(1) V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification 0 500 JESD22-C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommend Operating Conditions Over operating free-air temperature range, unless otherwise noted. MIN MAX UNIT VIN Input voltage range 2.5 5.5 V VPG Power good pull-up resistor voltage VIN V VOUT Output voltage range 0.8 VIN V IOUT Output current range 0 4.0 A TJ Operating junction temperature -40 125 °C 6.4 Thermal Information THERMAL METRIC(1) RGT (16 PINS) UNIT RθJA Junction-to-ambient thermal resistance 47 RθJC(top) Junction-to-case (top) thermal resistance 60 RθJB Junction-to-board thermal resistance 20 °C/W ψJT Junction-to-top characterization parameter 1.5 ψJB Junction-to-board characterization parameter 20 RθJC(bot) Junction-to-case (bottom) thermal resistance 5.3 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953 4 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: TPS62095 |
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