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TPS62095 Datasheet(PDF) 4 Page - Texas Instruments

Part # TPS62095
Description  TPS62095 4A, High Efficiency Step Down Converter with DCS-Control and Low Profile Solution
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPS62095 Datasheet(HTML) 4 Page - Texas Instruments

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TPS62095
SLVSBD8A – APRIL 2014 – REVISED MAY 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
(1)
MIN
MAX
UNIT
Voltage at pins(2)
PVIN, AVIN, FB, SS, EN, DEF, VOS
-0.3
7.0
V
SW, PG
-0.3
VIN+0.3
Sink current
PG
1.0
mA
Operating junction
-40
150
°C
temperature
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground pin.
6.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
–65
150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
0
2000
pins(1)
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification
0
500
JESD22-C101, all pins(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommend Operating Conditions
Over operating free-air temperature range, unless otherwise noted.
MIN
MAX
UNIT
VIN
Input voltage range
2.5
5.5
V
VPG
Power good pull-up resistor voltage
VIN
V
VOUT
Output voltage range
0.8
VIN
V
IOUT
Output current range
0
4.0
A
TJ
Operating junction temperature
-40
125
°C
6.4 Thermal Information
THERMAL METRIC(1)
RGT (16 PINS)
UNIT
RθJA
Junction-to-ambient thermal resistance
47
RθJC(top)
Junction-to-case (top) thermal resistance
60
RθJB
Junction-to-board thermal resistance
20
°C/W
ψJT
Junction-to-top characterization parameter
1.5
ψJB
Junction-to-board characterization parameter
20
RθJC(bot)
Junction-to-case (bottom) thermal resistance
5.3
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953
4
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Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: TPS62095


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