ABSOLUTE MAXIMUM RATINGS

(1)

DISSIPATION RATINGS

(1)

RECOMMENDED OPERATING CONDITIONS

TPS62110-EP

TPS62111-EP

TPS62112-EP

This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields.

These circuits have been qualified to protect this device against electrostatic discharges; HBM according to EIA/JESD22-A114-B,

MM according EIA/JESD22-A115-A, and CDM according EIA/JESD22C101C; however, it is advised that precautions be taken to

avoid application of any voltage higher than maximum-rated voltages to these high-impedance circuits. During storage or handling

the device leads should be shorted together or the device should be placed in conductive foam. In a circuit, unused inputs should

always be connected to an appropriate logic voltage level, preferably either VCC or ground. Specific guidelines for handling devices

of this type are contained in the publication Guidelines for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices and

Assemblies available from Texas Instruments.

PLASTIC QFN

OUTPUT

LBI/LBO

MARKING

VOLTAGE

FUNCTIONALITY

TPS62110MRSAREP

Adjustable

Standard

TPS62110-EP

1.2 V to 16 V

–55°C to 125°C

TPS62111MRSAREP

3.3 V

Standard

TPS62111-EP

TPS62112MRSAREP

5 V

Standard

TPS62112-EP

(1)

For the most current package and ordering information, see the Package Option Addendum at the end

of this document, or see the TI website at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

The RSA package is available in tape and reel. Add R suffix (TPS62110RSAR) to order quantities of

3000 parts per reel. Add T suffix (TPS62110RSAT) to order quantities of 250 parts per reel

over operating free-air temperature range (unless otherwise noted)

UNIT

Supply voltage at VIN, VINA

–0.3 V to 20 V

Voltage at SW

Voltage at EN, SYNC, LBO, PG

–0.3 V to 20 V

Voltage at LBI, FB

–0.3 V to 7 V

Output current at SW

2400 mA

Maximum junction temperature

150°C

Storage temperature

–65°C to 150°C

Lead temperature 1,6 mm (1/16-inch) from case for 10 seconds

300°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DERATING FACTOR

PACKAGE

POWER RATING

POWER RATING

POWER RATING

RSA

2.5 W

25 mW/°C

1.375 W

1 W

(1)

Based on a thermal resistance of 40 K/W soldered onto a high K board.

MIN

MAX

UNIT

Supply voltage at VIN, VINA

3.1

17

V

Maximum voltage at power-good, LBO, EN, SYNC

17

V

Operating junction temperature

–55

125

°C

Copyright © 2007–2008, Texas Instruments Incorporated

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