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SN74LVC1G57DCKR Datasheet(PDF) 1 Page - Texas Instruments |
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SN74LVC1G57DCKR Datasheet(HTML) 1 Page - Texas Instruments |
1 / 14 page SN74LVC1G57 CONFIGURABLE MULTIPLEFUNCTION GATE SCES414G − NOVEMBER 2002 − REVISED SEPTEMBER 2003 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Available in the Texas Instruments NanoStar and NanoFree Packages D Supports 5-V VCC Operation D Inputs Accept Voltages to 5.5 V D Max tpd of 6.3 ns at 3.3 V D Low Power Consumption, 10-µA Max ICC D ±24-mA Output Drive at 3.3 V D Ioff Supports Partial-Power-Down Mode Operation D Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II D ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) description/ordering information This configurable multiple-function gate is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC1G57 features configurable multiple functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XNOR, inverter, and noninverter. All inputs can be connected to VCC or GND. This device functions as an independent gate, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT−) signals. NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package. ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING‡ NanoStar − WCSP (DSBGA) 0.17-mm Small Bump − YEA SN74LVC1G57YEAR NanoFree − WCSP (DSBGA) 0.17-mm Small Bump − YZA (Pb-free) Tape and reel SN74LVC1G57YZAR _ _ _CL_ −40 °C to 85°C NanoStar − WCSP (DSBGA) 0.23-mm Large Bump − YEP Tape and reel SN74LVC1G57YEPR _ _ _CL_ NanoFree − WCSP (DSBGA) 0.23-mm Large Bump − YZP (Pb-free) SN74LVC1G57YZPR SOT (SOT-23) − DBV Tape and reel SN74LVC1G57DBVR CA7_ SOT (SC-70) − DCK Tape and reel SN74LVC1G57DCKR CL_ † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Copyright 2003, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar and NanoFree are trademarks of Texas Instruments. DBV OR DCK PACKAGE (TOP VIEW) 1 2 3 6 5 4 In1 GND In0 In2 VCC Y 3 2 1 4 5 6 In0 GND In1 Y VCC In2 YEA, YEP, YZA OR YZP PACKAGE (BOTTOM VIEW) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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