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NIS5431MT1TWG Datasheet(PDF) 2 Page - ON Semiconductor |
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NIS5431MT1TWG Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 8 page NIS5431 Series www.onsemi.com 2 VIN VOUT Enable/Fault GND Thermal Shutdown Charge Pump Current Limit dv/dt Control Enable UVLO dV/dt I LIMITB Voltage Clamp Figure 1. Block Diagram I LIMITA FUNCTIONAL PIN DESCRIPTION Pin Function Description 1−5 Source This pin is the source of the internal power FET and the output terminal of the fuse. 6 ILIMITA A resistor between this pin and the ILIMITB pin sets the overload and short circuit current limit levels. 7 ILIMITB A resistor between this pin and the ILIMITA pin sets the overload and short circuit current limit levels. 8 Enable/Fault The enable/fault pin is a tri−state, bidirectional interface. It can be used to enable or disable the output of the device by pulling it to ground using an open drain or open collector device. If a thermal fault occurs, the voltage on this pin will go to an intermediate state to signal a monitoring circuit that the device is in thermal shutdown. It can also be connected to another device in this family to cause a simultaneous shutdown during thermal events. 9 dv/dt The internal dv/dt circuit controls the slew rate of the output voltage at turn on. It has an internal ca- pacitor that allows it to ramp up over a period of 1.4 ms. An external capacitor can be added to this pin to increase the ramp time. If an additional time delay is not required, this pin should be left open. 10 Ground Negative input voltage to the device. This is used as the internal reference for the IC. 11 (belly pad) VCC Positive input voltage to the device. MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage, operating, steady−state (VCC to GND, Note 1) VIN −0.6 to 14 V Thermal Resistance, Junction−to−Air 0.1 in2 copper (Note 2) 0.5 in2 copper (Note 2) JESD51−7 4−layer board qJA 154 93 50 °C/W Thermal Resistance, Junction−to−Lead (Pin 1) qJL 49 °C/W Thermal Resistance, Junction−to−Case qJC 20 °C/W Total Power Dissipation @ TA = 25°C (operating) Pmax 2.5 W Operating Temperature Range (Notes 3 and 4) TJ −40 to 150 °C Nonoperating Temperature Range TJ −55 to 155 °C Lead Temperature, Soldering (10 Sec) TL 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Negative voltage will not damage device provided that the power dissipation is limited to the rated allowable power for the device. 2. 1 oz copper, double−sided FR4. 3. Thermal limit is set above the maximum thermal rating. It is not recommended to operate this device at temperatures greater than the maximum ratings for extended periods of time. 4. Exceeding TJ will thermally destroy the FET. See AND9042/D. |
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