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NCV59300 Datasheet(PDF) 2 Page - ON Semiconductor

Part # NCV59300
Description  3.0 A, Very Low-Dropout (VLDO) Fast Transient Response Regulator series
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCV59300 Datasheet(HTML) 2 Page - ON Semiconductor

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NCP59300, NCV59300 Series
http://onsemi.com
2
TYPICAL APPLICATIONS
Figure 1. Fixed 2.5 V Regulator with Error Flag
+
+
COUT
47 mF, Ceramic
100k
VIN
EN
VOUT
FLG
GND
VOUT = 2.5 V
CIN
VIN = 3.0 V
NCP59301
Figure 2. Fixed 2.5 V Regulator in D2PAK−3 Package
+
+
COUT
47 mF, Ceramic
VIN
VOUT
GND
VOUT = 2.5 V
CIN
VIN = 3.0 V
NCP59300
PIN FUNCTION DESCRIPTION
Pin Number
D2PAK−5
Pin Number
D2PAK−3
Pin Name
Pin Function
1
EN
Enable Input: CMOS and TTL logic compatible. Logic high = enable; Logic low =
shutdown.
2
1
VIN
Input voltage which supplies both the internal circuitry and the current to the output
load
3
2
GND
Ground
TAB
TAB
TAB
TAB is connected to ground.
4
3
VOUT
Linear Regulator Output.
5
FLG
Error Flag Open collector output.
Active−low indicates an output fault condition.
ABSOLUTE MAXIMUM RATINGS
Symbol
Rating
Value
Unit
VIN
Supply Voltage
0 to 18
V
VEN
Enable Input Voltage
0 to 18
V
VFLG
Error Flag Open Collector Output Maximum Voltage
0 to 18
V
VOUT – VIN
Reverse VOUT – VIN Voltage (EN = Shutdown or VIN = 0 V) (Note 1)
0 to 6.5
V
PD
Power Dissipation (Notes 2 and 3)
Internally Limited
TJ
Junction Temperature
–40 v TJ v +125
C
TS
Storage Temperature
–65 v TJ v +150
C
ESD Rating (Notes 4 and 5)
Human Body Model
Machine Model
2000
200
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: All voltages are referenced to GND pin unless otherwise noted.
1. The ENABLE pin input voltage must be  0.8 V or VIN must be connected to ground potential.
2. PD(max) = (TJ(max) – TA) / RqJA, where RqJA depends upon the printed circuit board layout.
3. This protection is not guaranteed outside the Recommended Operating Conditions.
4. Devices are ESD sensitive. Handling precautions recommended..
5. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model (HBM) tested per AEC*Q100*002 (EIA/JESD22*A114C)
ESD Machine Model (MM) tested per AEC*Q100*003 (EIA/JESD22*A115C)
This device contains latch*up protection and exceeds 100 mA per JEDEC Standard JESD78.


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