L2TVS10.0A thru L2TVS190A

Surface Mount Transient Voltage Suppressors

Peak Pulse Power 200W Stand-off Voltage 10.0 to 190V

www.goodark.com

1/5

2014.04-Rev.A

Features

• Glass passivated junction

• Moisture sensitivity: level 1, per J-STD-020

• Solder dip 260 °C10 s

Solder dip 260 C, 10 s

• Low profile， typical thickness 1.0mm

• Polarity:Uni-directional

• Excellent clamping capability and Fast response time

• 200W peak pulse power capability with a 10/1000us waveform

Typical Applications

eSGB (SMAF)

yp

pp

Use in sensitive electronics protection against voltage transients induced by inductive load

switching and lighting on Ics,MOSFET,signal lines of sensor units for consumer, computer,

industrial and telecommunication

Parameter

Symbol

Value

Unit

Peak power dissipation with a

10/1000us waveform

1)

Minimum 200

W

Peak pulse current with a

10/1000us waveform

A

See Next Table

1)

10/1000us waveform

Thermal resistance junction to

W

V

A

℃/W

0.5

30.0

3.5

80

2)

Rthja

Maximum instantaneous forward

voltage at 25A

Steady state power dissipation on

infinite heatsink

Peak forward surge current,8.3ms

single half sine-wave uni-

Notes:

1) Non-repetitive current,per fig.3 and derated above TA=25℃ per fig.4.

2) Power dissipation mounted on recommended pad layout

3) Thermal resistance from junction to ambient mounted on PCB with 8 0×8 0mm copper pads

Thermal resistance junction to

ambient air

℃/W

-65 to +150

℃

Operating junction and storage

temperature range

80

Rthja

TJ, TSTG

3) Thermal resistance from junction to ambient,mounted on PCB with 8.0×8.0mm copper pads

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1/5

2014.04-Rev.A