MC78LC00 Series

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4

HT SUFFIX

Characteristic

Symbol

Min

Typ

Max

Unit

Output Voltage

2.950

3.218

3.900

4.875

3.0

3.3

4.0

5.0

3.075

3.382

4.100

5.125

V

Line Regulation

−

0.05

0.2

%/V

−

−

−

−

40

40

50

60

60

60

70

90

mV

Output Current (Note 12)

35

35

45

55

50

50

65

80

−

−

−

−

mA

Dropout Voltage

−

−

−

−

40

35

25

25

60

53

38

38

mV

Quiescent Current

−

−

−

−

1.1

1.1

1.2

1.3

3.3

3.3

3.6

3.9

mA

Output Voltage Temperature Coefficient

−

±100

−

ppm/

°C

7. This device series contains ESD protection and exceeds the following tests:

Human Body Model 2000 V per MIL−STD−883, Method 3015

Machine Model Method 200 V

8. Latch up capability (85

°C) "100 mA

9. Maximum package power dissipation limits must be observed.

PD

+

TJ(max) * TA

R

qJA

10. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.

11. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.

DEFINITIONS

Load Regulation

The change in output voltage for a change in output current

at a constant temperature.

Dropout Voltage

The input/output differential at which the regulator output

no longer maintains regulation against further reductions in

input voltage. Measured when the output drops 3% below its

nominal. The junction temperature, load current, and

minimum input supply requirements affect the dropout level.

Maximum Power Dissipation

The maximum total dissipation for which the regulator will

operate within its specifications.

Quiescent Current

The quiescent current is the current which flows through the

ground when the LDO operates without a load on its output:

internal IC operation, bias, etc. When the LDO becomes

loaded, this term is called the Ground current. It is actually the

difference between the input current (measured through the

LDO input pin) and the output current.

Line Regulation

The change in output voltage for a change in input voltage.

The measurement is made under conditions of low dissipation

or by using pulse technique such that the average chip

temperature is not significantly affected.

Line Transient Response

Typical over and undershoot response when input voltage is

excited with a given slope.

Maximum Package Power Dissipation

The maximum power package dissipation is the power

dissipation level at which the junction temperature reaches its

maximum operating value, i.e. 125

°C. Depending on the

ambient power dissipation and thus the maximum available

output current.