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NCV78L05ABPRMG Datasheet(PDF) 2 Page - ON Semiconductor |
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NCV78L05ABPRMG Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 15 page MC78L00A Series, NCV78L00A www.onsemi.com 2 Figure 2. Standard Application A common ground is required between the input and the output voltages. The input voltage must remain typically 2.0 V above the output voltage even during the low point on the input ripple voltage. * Cin is required if regulator is located an appreciable distance from power supply filter. ** CO is not needed for stability; however, it does improve transient response. MC78LXXA Input Cin* 0.33 mF CO** 0.1 mF Output ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (5.0 V−9.0 V) Input Voltage (12 V−18 V) Input Voltage (24 V) VI 30 35 40 Vdc Storage Temperature Range Tstg −65 to +150 °C Maximum Junction Temperature TJ 150 °C Moisture Sensitivity Level MSL 1 − ESD Capability, Human Body Model (Note 1) ESDHBM 2000 V ESD Capability, Machine Model (Note 1) ESDMM 200 V ESD Capability, Charged Device Model (Note 1) ESDCDM 2000 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model. THERMAL CHARACTERISTICS Rating Symbol Value Unit Package Dissipation PD Internally Limited W Thermal Characteristics, TO−92 Thermal Resistance, Junction−to−Ambient RqJA 200 °C/W Thermal Characteristics, SOIC8 Thermal Resistance, Junction−to−Ambient RqJA Refer to Figure 8 °C/W Thermal Characteristics, SOT−89 Thermal Resistance, Junction−to−Ambient RqJA 55 °C/W 2. Thermal Resistance, Junction−to−Ambient depends on P.C.B. Copper area. See details in Figure 8. Thermal Resistance, Junction−to−Case is not defined. SOIC 8 lead and TO-92 packages that do not have a heat sink like other packages may have. This is the reason that a Theta JC is never specified. A little heat transfer will occur through the package but since it is plastic, it is minimal. The majority of the heat that is transferred is through the leads where they connect to the circuit board. |
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