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IDT72V3654 Datasheet(PDF) 9 Page - Integrated Device Technology

Part # IDT72V3654
Description  3.3 VOLT CMOS SyncBiFIFOTM WITH BUS-MATCHING 2,048 x 36 x 2 4,096 x 36 x 2 8,192 x 36 x 2
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

IDT72V3654 Datasheet(HTML) 9 Page - Integrated Device Technology

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COMMERCIALTEMPERATURERANGE
IDT72V3654/72V3664/72V3674 3.3V CMOS SyncBiFIFOTM WITH BUS-MATCHING
2,048 x 36 x 2, 4,096 x 36 x 2 and 8,192 x 36 x 2
TIMING REQUIREMENTS OVER RECOMMENDED RANGES OF SUPPLY
VOLTAGE AND OPERATING FREE-AIR TEMPERATURE
IDT72V3654L10(1)
IDT72V3654L15
IDT72V3664L10(1)
IDT72V3664L15
IDT72V3674L10(1)
IDT72V3674L15
Symbol
Parameter
Min.
Max.
Min.
Max.
Unit
fS
Clock Frequency, CLKA or CLKB
100
66.7
MHz
tCLK
Clock Cycle Time, CLKA or CLKB
10
15
ns
tCLKH
Pulse Duration, CLKA or CLKB HIGH
4.5
6
ns
tCLKL
Pulse Duration, CLKA and CLKB LOW
4.5
6
ns
tDS
Setup Time, A0-A35 before CLKA
↑ and B0-B35 before CLKB↑
3—4
ns
tENS1
Setup Time,
CSA and W/RA before CLKA
↑; CSB and
4
4.5
ns
W/RB before CLKB
tENS2
Setup Time, ENA, and MBA before CLKA
↑; ENB, and
3
4.5
ns
MBB before CLKB
tRSTS
Setup Time,
MRS1, MRS2, PRS1, or PRS2 LOW before
5
5
ns
CLKA
↑orCLKB↑(2)
tFSS
Setup Time, FS0, FS1, FS2 before
MRS1 and MRS2 HIGH
7.5
7.5
ns
tBES
Setup Time, BE/
FWFT before MRS1 and MRS2 HIGH
7.5
7.5
ns
tSDS
Setup Time, FS0/SD before CLKA
3—4
ns
tSENS
Setup Time, FS1/
SEN before CLKA
3—4
ns
tFWS
Setup Time, BE/
FWFT before CLKA
0—0
ns
tRTMS
Setup Time, RTM before
RT1; RTM before RT2
5—5
ns
tDH
Hold Time, A0-A35 after CLKA
↑and B0-B35 after CLKB↑
0.5
1
ns
tENH
Hold Time,
CSA, W/RA, ENA, and MBA after CLKA
↑; CSB,
0.5
1
ns
W/RB, ENB, and MBB after CLKB
tRSTH
Hold Time,
MRS1, MRS2, PRS1 or PRS2 LOW after CLKA
4—4
ns
or CLKB
(2)
tFSH
Hold Time, FS0, FS1, FS2 after
MRS1 and MRS2 HIGH
2
2
ns
tBEH
Hold Time, BE/
FWFT after MRS1 and MRS2 HIGH
2
2
ns
tSDH
Hold Time, FS0/SD after CLKA
0.5
1
ns
tSENH
Hold Time, FS1/
SEN HIGH after CLKA
0.5
1
ns
tSPH
Hold Time, FS1/
SEN HIGH after MRS1 and MRS2 HIGH
2
2
ns
tRTMH
Hold Time, RTM after
RT1; RTM after RT2
5—5
ns
tSKEW1(3)
Skew Time between CLKA
↑and CLKB↑ for EFA/ORA,
5
7.5
ns
EFB/ORB, FFA/IRA, and FFB/IRB
tSKEW2(3,4)
Skew Time between CLKA
↑ and CLKB↑ for AEA, AEB, AFA,12
12
ns
and
AFB
NOTES:
1. For 10ns speed grade: Vcc = 3.3V
± 0.15V; TA = 0° to +70°.
2. Requirement to count the clock edge as one of at least four needed to reset a FIFO.
3. Skew time is not a timing constraint for proper device operation and is only included to illustrate the timing relationship between CLKA cycle and CLKB cycle.
4. Design simulated, not tested.
(For 10ns speed grade only: Vcc = 3.3V ± 0.15V; TA = 0
° C to +70° C; JEDEC JESD8-A compliant)


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