NCP662, NCV662, NCP663, NCV663

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9

PACKAGE DIMENSIONS

SC−82AB

CASE 419C−02

ISSUE F

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. 419C−01 OBSOLETE. NEW STANDARD IS

419C−02.

4. DIMENSIONS A AND B DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS, OR GATE

BURRS.

12

3

A

G

S

N

J

K

4

B

F

L

C

H

0.05 (0.002)

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

1.80

2.20

0.071

0.087

B

1.15

1.35

0.045

0.053

C

0.80

1.10

0.031

0.043

D

0.20

0.40

0.008

0.016

F

0.30

0.50

0.012

0.020

G

1.10

1.50

0.043

0.059

H

0.00

0.10

0.000

0.004

J

0.10

0.26

0.004

0.010

K

0.10

−−−

0.004

−−−

L

0.05 BSC

0.002 BSC

N

0.20 REF

0.008 REF

S

1.80

2.40

0.07

0.09

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

1.30

0.0512

mm

inches

SCALE 10:1

0.65

0.026

1.90

0.075

0.90

0.035

0.70

0.028

0.95

0.037

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