AMD Geode™ GX2 Clock Source

MDS 1491-09 G

6

Revision 080204

Integrated Circuit Systems, Inc.

MK1491-09

AC Electrical Characteristics

Unless stated otherwise, VDD = 3.3 V, Ambient Temperature 0 to +70

° C

Note 1: Only valid when PCI is at 33 MHz.

Thermal Characteristics

Parameter

Symbol

Conditions

Min.

Typ.

Max.

Units

Input Frequency

14.31818

MHz

Output Clock Skew Rate (PCI

and LPC), load = 30 pF

Between 0.4 V and 2.4 V

4

V/ns

Output Clock Rise and Fall

Time (all but PCI and LPC),

load=pF

Between 0.4 V and 2.4 V

0.5

2

ns

Output Clock Duty Cycle, all

MHz Clocks

At 1.5 V

40

60

%

PCI Output to Output Skew, at

33 MHz

Rising edges at 1.5 V

500

ps

PCI Output to Output Skew, at

66 MHz

Rising edges at 1.5 V

250

ps

LPC Output to Output Skew

Rising edges at 1.5 V

500

ps

PCI to LPC Output to Output

Skew (note 1)

Rising edge at 1.5 V

500

ns

Cycle-to-Cycle Jitter, PCICLK

300

ps

Cycle-to-Cycle Jitter, LPCCLK

500

ps

Cycle-to-Cycle Jitter, USBCLK

and 48 MHz

500

ps

Cycle-to-Cycle Jitter, REFCLKs

1400

ps

Power-on Time, applied VDD to

all Clocks Stable

5ms

Load Capacitance Crystal

18

pF

Parameter

Symbol

Conditions

Min.

Typ.

Max.

Units

Thermal Resistance Junction to

Ambient

θ

JA

Still air

100

°C/W

θ

JA

1 m/s air flow

80

°C/W

θ

JA

3 m/s air flow

67

°C/W

Thermal Resistance Junction to Case

θ

JC

60

°C/W