NCP51200, NCV51200

www.onsemi.com

7

PACKAGE DIMENSIONS

DFN10, 3x3, 0.5P

CASE 485C

ISSUE E

10X

SEATING

PLANE

L

D

E

0.15 C

A

A1

e

D2

E2

b

15

10

6

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS

MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS

THE TERMINALS.

5. TERMINAL b MAY HAVE MOLD COMPOUND MATERIAL ALONG

SIDE EDGE. MOLD FLASHING MAY NOT EXCEED 30 MICRONS

ONTO BOTTOM SURFACE OF TERMINAL b.

6. FOR DEVICE OPN CONTAINING W OPTION, DETAIL A AND B

ALTERNATE CONSTRUCTION ARE NOT APPLICABLE. WET-

TABLE FLANK CONSTRUCTION IS DETAIL B AS SHOWN ON

SIDE VIEW OF PACKAGE.

B

A

0.15 C

TOP VIEW

SIDE VIEW

BOTTOM VIEW

PIN ONE

REFERENCE

0.10 C

0.08 C

(A3)

C

10X

10X

0.10 C

0.05 C

A B

NOTE 3

K

DIM

MIN

MAX

MILLIMETERS

A

0.80

1.00

A1

0.00

0.05

A3

0.20 REF

b

0.18

0.30

D

3.00 BSC

D2

2.40

2.60

E

3.00 BSC

E2

1.70

1.90

e

0.50 BSC

L

0.35

0.45

L1

0.00

0.03

DETAIL A

K

0.19 TYP

2X

2X

DETAIL B

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTIONS

A1

A3

2.64

1.90

0.50

0.55

10X

3.30

0.30

10X

DIMENSIONS: MILLIMETERS

PITCH

PACKAGE

OUTLINE

L1

DETAIL A

L

ALTERNATE TERMINAL

CONSTRUCTIONS

L

ALTERNATE B−2

ALTERNATE B−1

ALTERNATE A−2

ALTERNATE A−1

DETAIL B

WETTABLE FLANK OPTION

CONSTRUCTION

A1

A3

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