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STP16NK60Z Datasheet(PDF) 3 Page - STMicroelectronics |
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3 / 11 page 3/11 STP16NK60Z - STB16NK60Z-S - STW16NK60Z ELECTRICAL CHARACTERISTICS (TCASE =25°C UNLESS OTHERWISE SPECIFIED) ON/OFF DYNAMIC SOURCE DRAIN DIODE Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %. 2. Pulse width limited by safe operating area. 3. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS. Symbol Parameter Test Conditions Min. Typ. Max. Unit V(BR)DSS Drain-source Breakdown Voltage ID =1mA,VGS = 0 600 V IDSS Zero Gate Voltage Drain Current (VGS =0) VDS =Max Rating VDS =Max Rating,TC = 125 °C 1 50 µA µA IGSS Gate-body Leakage Current (VDS =0) VGS = ± 20V ±10 µA VGS(th) Gate Threshold Voltage VDS =VGS,ID = 100 µA 3 3.75 4.5 V RDS(on) Static Drain-source On Resistance VGS =10V, ID = 7 A 0.38 0.42 Ω Symbol Parameter Test Conditions Min. Typ. Max. Unit gfs (1) Forward Transconductance VDS =15V, ID =7 A 12 S Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 25V,f= 1MHz,VGS = 0 2650 285 62 pF pF pF Coss eq. (3) Equivalent Output Capacitance VGS =0V, VDS = 0V to 480V 158 pF td(on) tr td(off) tf Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time VDD =480 V, ID =14 A RG =4.7Ω VGS =10 V (Resistive Load see, Figure 3) 30 25 70 15 ns ns ns ns Qg Qgs Qgd Total Gate Charge Gate-Source Charge Gate-Drain Charge VDD =480V, ID =14 A, VGS =10V 86 17 46 nC nC nC Symbol Parameter Test Conditions Min. Typ. Max. Unit ISD ISDM (2) Source-drain Current Source-drain Current (pulsed) 14 56 A A VSD (1) ForwardOnVoltage ISD =14A,VGS =0 1.6 V trr Qrr IRRM Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD =14A,di/dt =100 A/µs VDD =100 V, Tj =25°C (see test circuit, Figure 5) 490 5.4 22 ns µC A trr Qrr IRRM Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD =14A,di/dt =100 A/µs VDD =100 V, Tj =150°C (see test circuit, Figure 5) 585 7 24 ns µC A |
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