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NCV86601BD33R2G Datasheet(PDF) 3 Page - ON Semiconductor

Part # NCV86601BD33R2G
Description  Very Low Iq LD0 150 mA Regulator
Download  14 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCV86601BD33R2G Datasheet(HTML) 3 Page - ON Semiconductor

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NCV8660B
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3
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Min
Max
Unit
Input Voltage (IN)
VIN
−0.3
40
V
Input Current
IIN
−1.0
mA
Output Voltage (OUT)
DC
Transient, t < 10 s (Note 1)
VOUT
−0.3
−0.3
5.5
16
V
Output Current (OUT)
IOUT
−1.0
Current
Limited
mA
Storage Temperature Range
TSTG
−55
150
°C
DT (Reset Delay Time Select) Voltage (Note 2)
VDT
−0.3
16
V
DT (Reset Delay Time Select) Current (Note 2)
IDT
−1.0
1.0
mA
RO (Reset Output) Voltage
DC
Transient, t < 10 s
VRO
−0.3
−0.3
5.5
16
V
RO (Reset Output) Current
IRO
−1.0
1.0
mA
ESD CAPABILITY
ESD Capability, Human Body Model (Note 3)
ESDHB
−2.0
2.0
kV
ESD Capability, Machine Model (Note 3)
ESDMM
−200
200
V
ESD Capability, Charged Device Model (Note 3)
ESDCDM
−1.0
1.0
kV
THERMAL RESISTANCE
Junction−to−Case (Note 4)
DPAK 5
RqJC
15
°C/W
Junction−to−Ambient (Note 4)
DPAK 5
RqJA
66
°C/W
Junction−to−Tab (Note 4)
DPAK 5
RqJT
4.0
°C/W
Junction−to−Ambient (Note 4)
SOIC−8 FUSED
RqJA
104
°C/W
Junction−to−Lead (pin 6) (Note 4)
SOIC−8 FUSED
RqJT
33
°C/W
LEAD SOLDERING TEMPERATURE AND MSL
Moisture Sensitivity Level
DPAK 5
SOIC−8 FUSED
MSL
1
3
Lead Temperature Soldering: SMD style only, Reflow (Note 5)
Pb−Free Part 60 − 150 sec above 217°C, 40 sec max at peak
SLD
265 peak
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The output voltage must not exceed the input voltage.
2. External resistor required to minimize current to less than 1 mA when the control voltage is above 16 V.
3. This device series incorporates ESD protection and is tested by the following methods:
ESD HBM tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD MM tested per AEC−Q100−003 (EIA/JESD22−A115)
ESD CDM tested per EIA/JESD22/C101, Field Induced Charge Model
4. Values represented typical steady−state thermal performance on 1 oz. copper FR4 PCB with 1 in2 copper area.
5. Per IPC / JEDEC J−STD−020C.
OPERATING RANGE
Pin Symbol, Parameter
Symbol
Min
Max
Unit
VIN, Input Voltage Operating Range
VIN
4.5
40
V
Junction Temperature Range
TJ
−40
150
°C


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