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EMC1438-2-AP-TR Datasheet(PDF) 10 Page - SMSC Corporation |
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EMC1438-2-AP-TR Datasheet(HTML) 10 Page - SMSC Corporation |
10 / 48 page 1°C Multiple Temperature Sensor with Hardware Controlled Standby & Hottest of Multiple Zones Datasheet Revision 1.0 (04-29-10) 10 SMSC EMC1438 DATASHEET Chapter 3 Electrical Specifications 3.1 Absolute Maximum Ratings Note: Stresses at or above those listed could cause permanent damage to the device. This is a stress rating only and functional operation of the device at any other condition above those indicated in the operation sections of this specification is not implied. Prolonged stresses above the stated operating levels and below the Absolute Maximum Ratings may degrade device performance and lead to permanent damage. Note 3.1 For the 5V tolerant pins that have a pull-up resistor, the pull-up voltage must not exceed 3.6V when the device is unpowered. Note 3.2 The Package Power Dissipation specification assumes a thermal via design with the thermal landing soldered to the PCB ground plane with four 12 mil vias. Note 3.3 Junction to Ambient (JA) is dependent on the design of the thermal vias. Without thermal vias and a thermal landing, the θJA is approximately 60°C/W including localized PCB temperature increase. Table 3.1 Absolute Maximum Ratings DESCRIPTION RATING UNIT Supply Voltage (VDD) -0.3 to 4.0 V Voltage on 5V tolerant pins (V5VT_pin) -0.3 to 5.5 V Voltage on 5V tolerant pins (|V5VT_pin - VDD|) (see Note 3.1)0 to 3.6 V Voltage on any other pin to Ground -0.3 to VDD +0.3 V Operating Temperature Range -40 to +125 °C Storage Temperature Range -55 to +150 °C Lead Temperature Range Refer to JEDEC Spec. J-STD-020 QFN-16 Package Power Dissipation (see Note 3.2) 0.5W up to TA = 85°C W Junction to Ambient ( θJA) (see Note 3.3)58 °C/W ESD Rating, All pins HBM 2000 V |
Similar Part No. - EMC1438-2-AP-TR |
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Similar Description - EMC1438-2-AP-TR |
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