NCL30185A datasheet(5/28 Pages) ONSEMI

Part #	NCL30185A

Description	Power Factor Corrected Quasi-Resonant Primary Side Current-Mode Controller

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Manufacturer	ONSEMI [ON Semiconductor]

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NCL30185

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Table 2. MAXIMUM RATINGS TABLE

Symbol

Rating

Value

Unit

VCC(MAX)

ICC(MAX)

Maximum Power Supply voltage, VCC pin, continuous voltage

Maximum current for VCC pin

−0.3 to 30

Internally limited

V

mA

VDRV(MAX)

IDRV(MAX)

Maximum driver pin voltage, DRV pin, continuous voltage

Maximum current for DRV pin

−0.3, VDRV (Note 1)

−300, +500

V

mA

VMAX

IMAX

Maximum voltage on low power pins (except DRV and VCC pins)

Current range for low power pins (except DRV and VCC pins)

−0.3, 5.5 (Notes 2 and 5)

−2, +5

V

mA

RθJ−A

Thermal Resistance Junction−to−Air

180

°C/W

TJ(MAX)

Maximum Junction Temperature

150

°C

Operating Temperature Range

−40 to +125

°C

Storage Temperature Range

−60 to +150

°C

ESD Capability, HBM model (Note 3)

3.5

kV

ESD Capability, MM model (Note 3)

250

V

ESD Capability, CDM model (Note 3)

2

kV

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. VDRV is the DRV clamp voltage VDRV(high) when VCC is higher than VDRV(high). VDRV is VCC otherwise.

2. These levels are low enough not to exceed the maximum ratings of the internal ESD 5.5−V Zener diode. More positive and negative voltages

can be applied if the pin current stays within the −2−mA / 5−mA range.

3. This device contains ESD protection and exceeds the following tests: Human Body Model 3500 V per JEDEC Standard JESD22−A114E,

Machine Model Method 250 V per JEDEC Standard JESD22−A115B, Charged Device Model 2000 V per JEDEC Standard JESD22−C101E.

4. This device contains latch−up protection and has been tested per JEDEC Standard JESD78D, Class I and exceeds

±100 mA

5. Recommended maximum VS voltage for optimal operation is 4 V. −0.3 V to +4.0 V is hence, the VS pin recommended range.

Table 3. ELECTRICAL CHARACTERISTICS (Unless otherwise noted: For typical values TJ = 25°C, VCC = 12 V, VZCD = 0 V,

VCS = 0 V, VSD = 1.5 V) For min/max values TJ = −40°C to +125°C, VCC = 12 V)

Description

Test Condition

Symbol

Min

Typ

Max

Unit

STARTUP AND SUPPLY CIRCUITS

Supply Voltage

Startup Threshold

Minimum Operating Voltage

Hysteresis VCC(on) – VCC(off)

Internal logic reset

VCC rising

VCC falling

VCC(on)

VCC(off)

VCC(HYS)

VCC(reset)

16.0

8.2

8

4

18.0

8.8

−

5

20.0

9.4

−

6

V

VCC Over Voltage Protection Threshold

VCC(OVP)

25.5

26.8

28.5

V

VCC(off) noise filter

VCC(reset) noise filter

tVCC(off)

tVCC(reset)

−

5

20

−

ms

Startup current

ICC(start)

−

13

30

mA

Startup current in fault mode

ICC(sFault)

58

75

mA

Supply Current

Device Disabled/Fault

Device Enabled/No output load on pin 7

Device Switching (FSW = 65 kHz)

VCC > VCC(off)

Fsw = 65 kHz

CDRV = 470 pF, Fsw = 65 kHz

ICC1

ICC2

ICC3

0.8

–

−

1.0

2.5

3.0

1.2

4.0

4.5

mA

CURRENT SENSE

Maximum Internal current limit

VILIM

0.95

1.00

1.05

V

Leading Edge Blanking Duration for VILIM

tLEB

240

300

360

ns

Line feed−forward current

DRV high, VVS = 2 V

IFF

35

40

45

mA

6. Guaranteed by Design

7. A NTC is generally placed between the SD and GND pins. Parameters RTF(start), RTF(stop), ROTP(off) and ROTP(on) give the resistance the

NTC must exhibit to respectively, enter thermal foldback, stop thermal foldback, trigger the OTP limit and allow the circuit recovery after

an OTP situation.

8. At startup, when VCC reaches VCC(on), the controller blanks OTP for more than 250 ms to avoid detecting an OTP fault by allowing the

SD pin voltage to reach its nominal value if a filtering capacitor is connected to the SD pin.

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