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31-71-5450450 Datasheet(PDF) 6 Page - 3M Electronics |
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31-71-5450450 Datasheet(HTML) 6 Page - 3M Electronics |
6 / 12 page Problem Solution Higher frequencies require optimized grounding and Faraday Cage design Inherent bond line thickness EMI Shielding using 3M™ Electrically Conductive Adhesive Transfer Tape (ECATT) Poor “through tape” EMI Shielding leads to lower EMI SE at High Frequencies. Standard electrically conductive tape leads to EMI leakage through bond line tape thickness. 3M ECATT 9709SL 60dB EMI Shielding 0.1mHz 50mHz 10Hz 60db 3500 µm 35 µm 1000mHZ (1GHz) 10000mHZ (10GHz) Grounding Surface (R OK) Grounding Surface (Lower Contact R) Flex Circuit (FPC) Flex Circuit (FPC) Grounding Surface (R OK) Grounding Surface (Lower Contact R) Flex Circuit (FPC) Flex Circuit (FPC) 3M ECATT with inherent EMI shielding at the bond line provides significantly reduced crosstalk, stray EMI, noise in circuit, antennae effects, FPC susceptibility and spurious emissions. At High Frequencies, the effect of “through the tape thickness” EMI gaps or EMI slits is to allow EMI leakage. If the effective EMI gap/slit does not = “0”, EMI energy at high frequency can pass through a “standard conductive adhesive tape material” via the gap related to the adhesive thickness. The “Tape Bond Line Gap/Slit leakage effect” leads to poor EMI Shielding, cross-talk, degraded Signal-to-Noise ratio, etc. 4 Mobile Handheld & Tablet EMI/EMC Solutions 3M ECATT 9707, 9709S 3M™ Electrically Conductive Gaskets ECG-7050/ECG-8055/MSG-6100 3M Multi-functional EMI Shielding, Grounding and Heat Spreading Solutions. Hot device heat spreading & grounding, LED heat spreading and attachment. EMI and thermal management materials. Flex Printed Circuit Flex 3M ECATT 9709SL Grounding Surface Substrate Layer 3M Electrically Conductive Adhesive Transfer Tape 9709SL used for FPC grounding and EMI Shielding As frequency increases, is the “bond line gap” leading to stray EMI? (Cross talk, spurious EMI, signal degradation and noise.) |
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