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AMMC-5620 Datasheet(PDF) 7 Page - Agilent(Hewlett-Packard) |
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AMMC-5620 Datasheet(HTML) 7 Page - Agilent(Hewlett-Packard) |
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7 / 9 page  6 Biasing and Operation The AMMC- 5620 is normally biased with a single positive drain supply connected to the VDD bond pads shown in Figure 19. The recommended supply voltage is 5 V, which results in IDD = 95 mA (typical). No ground wires are required because all ground connections are made with plated through- holes to the backside of the device. Refer the Absolute Maximum Ratings table for allowed DC and thermal conditions. Assembly Techniques The backside of the AMMC- 5620 chip is RF ground. For microstripline applications, the chip should be attached directly to the ground plane (e.g., circuit carrier or heatsink) using electrically conductive epoxy [1]. For best performance, the topside of the MMIC should be brought up to the same height as the circuit surrounding it. This can be accomplished by mounting a gold plated metal shim (same length and width as the MMIC) under the chip, which is of the correct thickness to make the chip and adjacent circuit coplanar. The amount of epoxy used for chip and or shim attachment should be just enough to provide a thin fillet around the bottom perimeter of the chip or shim. The ground plane should be free of any residue that may jeopardize electrical or mechanical attachment. The location of the RF bond pads is shown in Figure 20. Note that all the RF input and output ports are in a Ground- Signal- Ground configuration. RF connections should be kept as short as reasonable to minimize performance degradation due to undesirable series inductance. A single bond wire is sufficient for signal connections, however double- bonding with 0.7 mil gold wire or the use of gold mesh [2] is recommended for best performance, especially near the high end of the frequency range. Thermosonic wedge bonding is the preferred method for wire attachment to the bond pads. Gold mesh can be attached using a 2 mil round tracking tool and a tool force of approximately 22 grams with an ultrasonic power of roughly 55 dB for a duration of 76 ± 8 mS. A guided wedge at an ultrasonic power level of 64 dB can be used for the 0.7 mil wire. The recommended wire bond stage temperature is 150 ± 2 °C. Caution should be taken to not exceed the Absolute Maximum Rating for assembly temperature and time. The chip is 100 µm thick and should be handled with care. This MMIC has exposed air bridges on the top surface and should be handled by the edges or with a custom collet (do not pick up die with vacuum on die center.) This MMIC is also static sensitive and ESD handling precautions should be taken. Notes: 1. Ablebond 84-1 LM1 silver epoxy is recommended. 2. Buckbee-Mears Corporation, St. Paul, MN, 800-262-3824 |
Similar Part No. - AMMC-5620 |
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Similar Description - AMMC-5620 |
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