BGA725L6

Maximum Ratings

Preliminary Data Sheet

9

Revision 2.0, 2012-03-09

1

Maximum Ratings

Attention: Stresses above the max. values listed here may cause permanent damage to the device.

Exposure to absolute maximum rating conditions for extended periods may affect device

reliability. Maximum ratings are absolute ratings; exceeding only one of these values may

cause irreversible damage to the integrated circuit.

Thermal Resistance

Table 2

Maximum Ratings

Parameter

Symbol

Values

Unit

Note /

Test Condition

Min.

Typ.

Max.

Voltage at pin VCC

V

CC

-0.3

–

3.6

V

1)

1) All voltages refer to GND-Node unless otherwise noted

Voltage at pin AI

V

AI

-0.3

–

0.9

V

–

Voltage at pin AO

V

AO

-0.3

–

V

V

–

Voltage at pin PON

V

PON

-0.3

–

V

V

–

Voltage at pin GNDRF

V

GNDRF

-0.3

–

0.3

V

–

Current into pin VCC

I

CC

––20

mA

–

RF input power

P

IN

––0dBm

–

Total power dissipation,

T

2)

2)

T

P

tot

––72

mW

–

Junction temperature

T

J

––150

°C

–

Ambient temperature range

T

A

-40

–

85

°C

–

Storage temperature range

T

STG

-65

–

150

°C

–

ESD capability all pins

V

ESD_HBM

–

–

2000

V

according to

JESD22A-114

Table 3

Thermal Resistance

Parameter

Symbol

Value

Unit

1) For calculation of

R

R

thJS

380

K/W