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AD9235BCP-40 Datasheet(PDF) 5 Page - Analog Devices |
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AD9235BCP-40 Datasheet(HTML) 5 Page - Analog Devices |
5 / 32 page REV. B –5– AD9235 ABSOLUTE MAXIMUM RATINGS 1 With Pin Name Respect to Min Max Unit ELECTRICAL AVDD AGND –0.3 +3.9 V DRVDD DGND –0.3 +3.9 V AGND DGND –0.3 +0.3 V AVDD DRVDD –3.9 +3.9 V Digital Outputs DGND –0.3 DRVDD + 0.3 V CLK, MODE AGND –0.3 AVDD + 0.3 V VIN+, VIN– AGND –0.3 AVDD + 0.3 V VREF AGND –0.3 AVDD + 0.3 V SENSE AGND –0.3 AVDD + 0.3 V REFB, REFT AGND –0.3 AVDD + 0.3 V PDWN AGND –0.3 AVDD + 0.3 V ENVIRONMENTAL 2 Operating Temperature –40 +85 °C Junction Temperature 150 °C Lead Temperature (10 sec) 300 °C Storage Temperature –65 +150 °C NOTES 1Absolute maximum ratings are limiting values to be applied individually and beyond which the serviceability of the circuit may be impaired. Functional operability is not necessarily implied. Exposure to absolute maximum rating conditions for an extended period of time may affect device reliability. 2Typical thermal impedances (28-lead TSSOP), θ JA = 67.7 °C/W; (32-lead LFCSP), θ JA = 32.5 °C/W, θ JC = 32.71 °C/W. These measurements were taken on a 4-layer board in still air, in accordance with EIA/JESD51-1. EXPLANATION OF TEST LEVELS I 100% production tested. II 100% production tested at 25 °C and sample tested at specified temperatures. III Sample tested only. IV Parameter is guaranteed by design and characterization testing. V Parameter is a typical value only. VI 100% production tested at 25 °C; guaranteed by design and characterization testing for industrial temperature range; 100% production tested at temperature extremes for military devices. ORDERING GUIDE Model Temperature Range Package Description Package Option AD9235BRU-20 –40 °C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28 AD9235BRU-40 –40 °C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28 AD9235BRU-65 –40 °C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28 AD9235BCP-20 * –40 °C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP) (Contact Factory) CP-32 AD9235BCP-40 * –40 °C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP) (Contact Factory) CP-32 AD9235BCP-65 * –40 °C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP) CP-32 AD9235-20PCB TSSOP Evaluation Board AD9235-40PCB TSSOP Evaluation Board AD9235-65PCB TSSOP Evaluation Board AD9235BCP-20EB LFCSP Evaluation Board (Contact Factory) AD9235BCP-40EB LFCSP Evaluation Board (Contact Factory) AD9235BCP-65EB LFCSP Evaluation Board *It is recommended that the exposed paddle be soldered to the ground plane. There is an increased reliability of the solder joints and maximum thermal capability of the package is achieved with exposed paddle soldered to the customer board. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD9235 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE |
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