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NCP382LD10AAR2G Datasheet(PDF) 8 Page - ON Semiconductor |
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NCP382LD10AAR2G Datasheet(HTML) 8 Page - ON Semiconductor |
8 / 12 page NCP382 www.onsemi.com 8 Enable Input Enable pin must be driven by a logic signal (CMOS or TTL compatible) or connected to the GND or VIN. A logic low on ENX or high on ENX turns−on the device. A logic high on ENX or low on ENX turns off device and reduces the current consumption down to IINOFF . Blocking Control The blocking control circuitry switches the bulk of the power MOS. When the part is off, the body diode limits the leakage current IREV from OUTX to IN. In this mode, anode of the body diode is connected to IN pin and cathode is connected to OUTX pin. In operating condition, anode of the body diode is connected to OUTX pin and cathode is connected to IN pin preventing the discharge of the power supply. APPLICATION INFORMATION Power Dissipation The junction temperature of the device depends on different contributing factors such as board layout, ambient temperature, device environment, etc... Yet, the main contributor in term of junction temperature is the power dissipation of the power MOSFET. Assuming this, the power dissipation and the junction temperature in normal mode can be calculated with the following equations: P D + RDS(on) I OUT1 2 ) I OUT2 2 (eq. 2) PD = Power dissipation (W) RDS(on) = Power MOSFET on resistance ( W) IOUTx = Output current in channel X (A) T J + PD RqJA ) TA (eq. 3) TJ = Junction temperature ( °C) RqJA = Package thermal resistance ( °C/W) TA = Ambient temperature ( °C) Power dissipation in regulation mode can be calculated by taking into account the drop VIN −VOUTX link to the load by the following relation: P D + V IN * RLOAD1 I OCP ) VIN * RLOAD2 I OCP (eq. 4) I OCP PD = Power dissipation (W) VIN = Input Voltage (V) RLOADX = Load Resistance on channel X ( W) IOCP = Output regulated current (A) PCB Recommendations The NCP382 integrates two PMOS FET rated up to 2 A, and the PCB design rules must be respected to properly evacuate the heat out of the silicon. The DFN8 PAD1 must be connected to ground plane to increase the heat transfer if necessary. Of course, in any case, this pad must not connect to any other potential. By increasing PCB area, the RqJA of the package can be decreased, allowing higher current . |
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