NCP382

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11

PACKAGE DIMENSIONS

DFN8, 3x3, 0.65P

CASE 506BW

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30mm FROM THE TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

A

B

E

D

D2

E2

BOTTOM VIEW

b

e

8X

0.10

B

0.05

A

C

C

K

8X

NOTE 3

2X

0.10 C

PIN ONE

REFERENCE

TOP VIEW

2X

0.10 C

A

A1

(A3)

0.05 C

0.05 C

C

SEATING

PLANE

SIDE VIEW

L

8X

14

5

8

DIM

MIN

MAX

MILLIMETERS

A

0.80

1.00

A1

0.00

0.05

A3

0.20 REF

b

0.25

0.35

D

3.00 BSC

D2

2.30

2.50

E

3.00 BSC

E2

1.55

1.75

e

0.65 BSC

K

0.20

−−−

L

0.35

0.45

8X

0.62

2.50

1.75

0.40

1

0.65

PITCH

3.30

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

RECOMMENDED

8X

DIMENSIONS: MILLIMETERS

L1

DETAIL A

L

OPTIONAL

CONSTRUCTIONS

L

DETAIL B

MOLD CMPD

EXPOSED Cu

OPTIONAL

CONSTRUCTIONS

DETAIL B

DETAIL A

L1

0.00

0.15

NOTE 4

e/2

SOLDERING FOOTPRINT*