9 / 17 page
CY7C1338F
Document #: 38-05218 Rev. *A
Page 9 of 17
ISB3
Automatic CE Power-Down
Current—CMOS Inputs
Max. VDD, Device Deselected,
VIN ≥ VDDQ – 0.3V or VIN ≤
0.3V,
f = fMAX, inputs switching
7.5-ns cycle, 133
MHz
75
mA
8.0-ns cycle, 117
MHz
70
mA
10-ns cycle, 100 MHz
65
mA
15-ns cycle, 66 MHz
45
mA
ISB4
Automatic CE Power-Down
Current—TTL Inputs
Max. VDD, Device Deselected,
VIN ≥ VDD – 0.3V or VIN ≤ 0.3V,
f = 0, inputs static
All speeds
45
mA
Electrical Characteristics Over the Operating Range (continued)[8, 9]
Parameter
Description
Test Conditions
CY7C1345F
Unit
Min.
Max.
Thermal Resistance[10]
Parameter
Description
Test Conditions
TQFP
Package
BGA
Package
Unit
ΘJA
Thermal Resistance
(Junction to Ambient)
Test conditions follow standard
test methods and procedures for
measuring thermal impedence,
per EIA / JESD51.
41.83
47.63
°C/W
ΘJC
Thermal Resistance
(Junction to Case)
9.99
11.71
°C/W
Capacitance[10]
Parameter
Description
Test Conditions
TQFP
Package
BGA
Package
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz,
VDD = 3.3V.
VDDQ = 3.3V
55
pF
CCLK
Clock Input Capacitance
5
5
pF
CI/O
Input/Output Capacitance
5
7
pF
AC Test Loads and Waveforms
Note:
10. Tested initially and after any design or process change that may affect these parameters.
OUTPUT
R = 317
Ω
R = 351
Ω
5pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
RL = 50Ω
Z0 = 50Ω
VL = 1.5V
3.3V
ALL INPUT PULSES
VDD
GND
90%
10%
90%
10%
≤ 1ns
≤ 1ns
(c)
OUTPUT
R = 1667
Ω
R =1538
Ω
5pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
RL = 50Ω
Z0 = 50Ω
VL = 1.25V
2.5V
ALL INPUT PULSES
VDD
GND
90%
10%
90%
10%
≤ 1ns
≤ 1ns
(c)
3.3V I/O Test Load
2.5V I/O Test Load
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
