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TPS730 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS730 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 31 page TPS730 SBVS054J – NOVEMBER 2004 – REVISED APRIL 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating junction temperature range (unless otherwise noted) (1) MIN MAX UNIT Input range, VIN –0.3 6 Voltage Enable range, VEN –0.3 6 V Output range, VOUT –0.3 6 Current Peak output, IOUT(max) Internally limited Continuous total power dissipation See Thermal Information DBV package –40 150 Junction, TJ Temperature YZQ package –40 125 °C Storage, Tstg –65 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101, ±500 all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted). MIN NOM MAX UNIT VIN Input supply voltage 2.7 5.5 V VEN Enable supply voltage 0 VIN V VOUT Output voltage VFB 5 V IOUT Output current 0 200 mA TJ Operating junction temperature –40 125 °C CIN Input capacitor 0.1 1 µF COUT Output capacitor 2.2(1) 10 µF CNR Noise reduction capacitor 0 10 nF CFF Feed-forward capacitor 15 pF R2 Lower feedback resistor 30.1 k Ω (1) If CFF is not used or VOUT(nom) < 1.8 V, the minimum recommended COUT = 4.7 µF. 6.4 Thermal Information TPS73001 THERMAL METRIC(1) DBV (SOT-23) YZQ (DSBGA) UNIT 6 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 225.1 178.5 RθJC(top) Junction-to-case (top) thermal resistance 78.4 1.4 RθJB Junction-to-board thermal resistance 54.7 62.1 °C/W ψJT Junction-to-top characterization parameter 3.3 0.9 ψJB Junction-to-board characterization parameter 53.8 62.1 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: TPS730 |
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