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IFX4949SJ Datasheet(PDF) 7 Page - Infineon Technologies AG |
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IFX4949SJ Datasheet(HTML) 7 Page - Infineon Technologies AG |
7 / 21 page IFX4949 General Product Characteristics Data Sheet 7 Rev. 1.0, 2012-05-07 4.2 Functional Range Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the Electrical Characteristics table. 4.3 Thermal Resistance Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go to www.jedec.org. Table 1 Pos. Parameter Symbol Limit Values Unit Conditions Min. Max. 4.2.1 Input Voltage Range for Normal Operation V IN 5.5 28 V – 4.2.2 Extended Input Voltage Range V IN 3.5 40 V –1) 2) 1) The output voltage will follow the input voltage for input voltages below V OUT + VDR, i.e device is in tracking mode until V OUT + VDR is reached. 2) Input voltages ranging from > 28 V up to 40 V may only be applied for transient periods t TR < 1s. Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max. IFX4949SJ (PG-DSO-8) 4.3.3 Junction to Soldering Point1) 1) Not subject to production test, specified by design. R thJSP –71 – K/W – 4.3.4 Junction to Ambient1) R thJA – 116 – K/W –2) 2) Specified R thJA value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The Product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu). 4.3.5 – 172 – K/W Footprint only3) 3) Specified R thJA value is according to JEDEC JESD 51-3 at natural convection on FR4 1s0p board; The Product (Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm3 board with 1 copper layer (1 x 70µm Cu). 4.3.6 – 145 – K/W 300 mm2 heatsink area on PCB3) 4.3.7 – 139 – K/W 600 mm2 heatsink area on PCB3) Thermal Shutdown 4.3.8 Junction Temperature T JSD – 165 – °C 1) |
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