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MAX11900 Datasheet(PDF) 4 Page - Maxim Integrated Products |
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MAX11900 Datasheet(HTML) 4 Page - Maxim Integrated Products |
4 / 29 page REFVDD, REF, REFIN, OVDD to GND ..................-0.3V to +4V AVDD, DVDD to GND .............................................-0.3V to +2V DGND to AGND, REFGND ..................................-0.3V to +0.3V AIN+, AIN- to GND ...... -0.3V to the lower of (VREF + 0.3V) and +4V or ±130mA SCLK, DIN, DOUT, CNVST, to GND........... -0.3V to the lower of (VOVDD + 0.3V) and +4V Maximum Current into Any Pin...........................................50mA Continuous Power Dissipation (TA = +70°C) TQFN (derate 30.30mW/°C above +70°C).............2424.2mW Operating Temperature Range........................... -40°C to +85°C Junction Temperature......................................................+150°C Storage Temperature Range............................ -65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow).......................................+260°C TQFN Junction-to-Ambient Thermal Resistance (θJA).... ......33°C/W Junction-to-Case Thermal Resistance (θJC) ............... 2°C/W (Note 1) (fSAMPLE = 1.6Msps, VAVDD = 1.8V, VDVDD = 1.8V, VOVDD = 1.5V to 3.6V, VREFVDD = 3.6V, VREF = 3.3V, Internal Ref Buffers On, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS ANALOG INPUT Input Voltage Range (Note 3) (AIN+) - (AIN-) -VREF +VREF V Absolute Input Voltage Range AIN+, AIN- relative to AGND -0.1 VREF + 0.1 V Common-Mode Input Range [(AIN+) + (AIN-)]/2 VREF/2 - 0.1 VREF/2 VREF/2 + 0.1 V Input Leakage Current Acquisition phase -1 0.001 +1 µA Input Capacitance 32 pF STATIC PERFORMANCE (Note 4) Resolution N 20 Bits Resolution LSB VREF = 3.3V 6.3 µV No Missing Codes 20 Bits Offset Error (Note 4) -10 ±1 +10 LSB Offset Temperature Coefficient ±0.01 LSB/°C Gain Error Referred to REFIN reference input -175 ±20 +175 LSB Gain Error Temperature Coefficient (Note 5) Referred to REFIN reference input ±0.2 LSB/°C Gain Error Referred to REF pins -42 ±10 +42 LSB Gain Error Temperature Coefficient (Note 5) Referred to REF pins ±0.12 LSB/°C Integral Nonlinearity INL -6 ±1.5 +6 LSB MAX11905 20-Bit, 1.6Msps, Low-Power, Fully Differential SAR ADC www.maximintegrated.com Maxim Integrated │ 4 Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics Electrical Characteristics |
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