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K7A401809B-QC Datasheet(PDF) 3 Page - Samsung semiconductor

Part # K7A401809B-QC
Description  128Kx36/x32 & 256Kx18 Synchronous SRAM
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

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K7A401800B
128Kx36/x32 & 256Kx18 Synchronous SRAM
- 3 -
Rev 1.0
Nov 2001
K7A403200B
K7A403600B
128Kx36 & 128Kx32 & 256Kx18-Bit Synchronous Pipelined Burst SRAM
The K7A403600B, K7A403200B and K7A401800B are
4,718,592-bit Synchronous Static Random Access Memory
designed for high performance second level cache of Pen-
tium and Power PC based System.
It is organized as 128K(256K) words of 36(18) bits and inte-
grates address and control registers, a 2-bit burst address
counter and added some new functions for high perfor-
mance cache RAM applications; GW, BW, LBO, ZZ. Write
cycles are internally self-timed and synchronous.
Full bus-width write is done by GW, and each byte write is
performed by the combination of WEx and BW when GW is
high. And with CS1 high, ADSP is blocked to control signals.
Burst cycle can be initiated with either the address status
processor(ADSP) or address status cache controller(ADSC)
inputs. Subsequent burst addresses are generated inter-
nally in the system
′s burst sequence and are controlled by
the burst address advance(ADV) input.
LBO pin is DC operated and determines burst sequence(lin-
ear or interleaved).
ZZ pin controls Power Down State and reduces Stand-by
current regardless of CLK.
The K7A403600B, K7A403200B and K7A401800B are fab-
ricated using SAMSUNG
′s high performance CMOS tech-
nology and is available in a 100pin TQFP package. Multiple
power and ground pins are utilized to minimize ground
bounce.
GENERAL DESCRIPTION
FEATURES
LOGIC BLOCK DIAGRAM
• Synchronous Operation.
• 2 Stage Pipelined operation with 4 Burst.
• On-Chip Address Counter.
• Self-Timed Write Cycle.
• On-Chip Address and Control Registers.
• VDD= 3.3V+0.3V/-0.165V Power Supply.
• VDDQ Supply Voltage 3.3V+0.3V/-0.165V for 3.3V I/O
or 2.5V+0.4V/-0.125V for 2.5V I/O.
• 5V Tolerant Inputs Except I/O Pins.
• Byte Writable Function.
• Global Write Enable Controls a full bus-width write.
• Power Down State via ZZ Signal.
• LBO Pin allows a choice of either a interleaved burst or a linear
burst.
• Three Chip Enables for simple depth expansion with No Data Cont-
nention ; 2cycle Enable, 1cycle Disable.
• Asynchronous Output Enable Control.
• ADSP, ADSC, ADV Burst Control Pins.
• TTL-Level Three-State Output.
• 100-TQFP-1420A .
• Operating in commeical and industrial temperature range.
CLK
LBO
ADV
ADSC
ADSP
CS1
CS2
CS2
GW
BW
WEx
OE
ZZ
DQa0 ~ DQd7
BURST CONTROL
LOGIC
BURST
128Kx36/32 , 256Kx18
ADDRESS
CONTROL
OUTPUT
DATA-IN
ADDRESS
COUNTER
MEMORY
ARRAY
REGISTER
REGISTER
BUFFER
LOGIC
A
′0~A′1
A0~A1
or A2~A17
A0~A16
REGISTER
DQPa ~ DQPd
or A0~A17
A2~A16
(x=a,b,c,d or a,b)
or DQa0 ~ DQb7
DQPa ~ DQPb
36/32 or 18
FAST ACCESS TIMES
PARAMETER
Symbol
-16
-14
Unit
Cycle Time
tCYC
6.0
7.2
ns
Clock Access Time
tCD
3.5
4.0
ns
Output Enable Access Time
tOE
3.5
4.0
ns


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