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NCV20072DR2G Datasheet(PDF) 5 Page - ON Semiconductor

Part # NCV20072DR2G
Description  Operational Amplifier, Railto- Rail Output
Download  23 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCV20072DR2G Datasheet(HTML) 5 Page - ON Semiconductor

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NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
www.onsemi.com
5
ABSOLUTE MAXIMUM RATINGS (Note 1)
Rating
Symbol
Limit
Unit
Supply Voltage (VDD – VSS) (Note 4)
VS
40
V
Input Voltage
VCM
VSS − 0.2 to VDD + 0.2
V
Differential Input Voltage (Note 2)
VID
±Vs
V
Maximum Input Current
IIN
±10
mA
Maximum Output Current (Note 3)
IO
±100
mA
Continuous Total Power Dissipation (Note 4)
PD
200
mW
Maximum Junction Temperature
TJ
150
°C
Storage Temperature Range
TSTG
−65 to 150
°C
Mounting Temperature (Infrared or Convection – 20 sec)
Tmount
260
°C
ESD Capability (Note 5)
Human Body Model
Machine Model − NCx20071
Machine Model − NCx20072, NCx20074
Charged Device Model − NCx20071/NCx20072
Charged Device Model − NCx20074
HBM
MM
MM
CDM
CDM
2000
200
150
2000 (C6)
1000 (C6)
V
Latch−Up Current (Note 6)
ILU
100
mA
Moisture Sensitivity Level (Note 7)
MSL
Level 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. Maximum input current must be limited to
±10 mA. Series connected resistors of at least 500 W on both inputs may be used to limit the
maximum input current to
±10 mA.
3. Total power dissipation must be limited to prevent the junction temperature from exceeding the 150
°C limit.
4. Continuous short circuit operation to ground at elevated ambient temperature can result in exceeding the maximum allowed junction
temperature of 150
°C. Output currents in excess of the maximum output current rating over the long term may adversely affect reliability.
Shorting output to either VDD or VSS will adversely affect reliability.
5. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per ANSI/ANSI/ESDA/JEDEC JS-001−2010 (AEC−Q100−002)
ESD Machine Model tested per JESD22−A115 (AEC−Q100−003)
ESD Charged Device Model tested per ANSI/ESD S5.3.1−2009 (AEC−Q100−011)
6. Latch−up Current tested per JEDEC standard: JESD78 (AEC−Q100−004)
7. Moisture Sensitivity Level tested per IPC/JEDEC standard: J−STD−020A
THERMAL INFORMATION
Parameter
Symbol
Package
Single Layer
Board (Note 8)
Multi−Layer
Board (Note 9)
Unit
Junction−to−Ambient
qJA
SOT23−5 / TSOP5
°C/W
SOT553−5
178
Micro8 / MSOP8
236
167
SOIC−8
190
131
TSSOP−8
253
194
SOIC−14
142
101
TSSOP−14
179
128
8. Values based on a 1S standard PCB according to JEDEC51−3 with 1.0 oz copper and a 300 mm2 copper area
9. Values based on a 1S2P standard PCB according to JEDEC51−7 with 1.0 oz copper and a 100 mm2 copper area
OPERATING RANGES
Parameter
Symbol
Min
Max
Unit
Operating Supply Voltage (Single Supply)
VS
2.7
36
V
Operating Supply Voltage (Split Supply)
VS
±1.35
±18
V
Differential Input Voltage (Note 10)
VID
VS
V
Input Common Mode Voltage Range
VCM
VSS
VDD − 1.35
V
Ambient Temperature
TA
−40
125
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
10. Maximum input current must be limited to
±10 mA. See Absolute Maximum Ratings for more information.


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