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NCV8184DG Datasheet(PDF) 8 Page - ON Semiconductor |
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NCV8184DG Datasheet(HTML) 8 Page - ON Semiconductor |
8 / 20 page NCV8184 http://onsemi.com 8 PACKAGE THERMAL DATA Parameter Conditions Typical Value Units SOIC−8 Package 100 mm2 Spreader Board 645 mm2 Spreader Board 1 oz 2 oz 1 oz 2 oz Junction−to−Pin 6 (Y−JL6, YJL6) 53 51 50 47 °C/W Junction−to−Ambient (RqJA, qJA) 151 135 111 100 °C/W Figure 24. PCB Layout and Package Construction for Simulation Package construction Without mold compound |
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