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NTD30N02T4 Datasheet(PDF) 2 Page - ON Semiconductor

Part # NTD30N02T4
Description  Power MOSFET 30 Amps, 24 Volts
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NTD30N02T4 Datasheet(HTML) 2 Page - ON Semiconductor

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NTD30N02
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage (Note 3)
(VGS = 0 Vdc, ID = 250 µAdc)
Temperature Coefficient (Positive)
V(BR)DSS
24
26.5
25.5
Vdc
mV/
°C
Zero Gate Voltage Drain Current
(VDS = 20 Vdc, VGS = 0 Vdc)
(VDS = 24 Vdc, VGS = 0 Vdc)
(VDS = 20 Vdc, VGS = 0 Vdc, TJ = 125°C)
IDSS
0.8
1.0
10
mAdc
Gate−Body Leakage Current (VGS = ± 20 Vdc, VDS = 0 Vdc)
IGSS
±100
nAdc
ON CHARACTERISTICS (Note 3)
Gate Threshold Voltage (Note 3)
(VDS = VGS, ID = 250 µAdc)
Threshold Temperature Coefficient (Negative)
VGS(th)
1.0
2.1
−4.1
3.0
Vdc
mV/
°C
Static Drain−to−Source On−Resistance (Note 3)
(VGS = 10 Vdc, ID = 30 Adc)
(VGS = 10 Vdc, ID = 20 Adc)
(VGS = 4.5 Vdc, ID = 15 Adc)
RDS(on)
11.2
20
14.5
14.5
24
m
W
Forward Transconductance (Note 3) (VDS = 10 Vdc, ID = 15 Adc)
gFS
20
mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
(V
20 Vd
V
0Vd
Ciss
1000
pF
Output Capacitance
(VDS = 20 Vdc, VGS = 0 Vdc,
f = 1.0 MHz)
Coss
425
Transfer Capacitance
f = 1.0 MHz)
Crss
175
SWITCHING CHARACTERISTICS (Note 4)
Turn−On Delay Time
td(on)
7.0
15
ns
Rise Time
(VDD = 20 Vdc, ID = 30 Adc,
tr
28
55
Turn−Off Delay Time
(VDD 20 Vdc, ID
30 Adc,
VGS = 10 Vdc, RG = 2.5 Ω)
td(off)
22
35
Fall Time
tf
12
20
Turn−On Delay Time
td(on)
12.5
ns
Rise Time
(VDD = 20 Vdc, ID = 15 Adc,
tr
115
Turn−Off Delay Time
(VDD 20 Vdc, ID
15 Adc,
VGS = 4.5 Vdc, RG = 2.5 Ω)
td(off)
15
Fall Time
tf
17
Gate Charge
(V
20 Vd
I
30 Ad
QT
14.4
20
nC
(VDS = 20 Vdc, ID = 30 Adc,
VGS = 4.5 Vdc) (Note 3)
Q1
4.0
VGS = 4.5 Vdc) (Note 3)
Q2
8.5
SOURCE−DRAIN DIODE CHARACTERISTICS
Forward On−Voltage
(IS = 15 Adc, VGS = 0 Vdc)
(IS = 30 Adc, VGS = 0 Vdc) (Note 3)
(IS = 15 Adc, VGS = 0 Vdc, TJ = 125°C)
VSD
0.95
1.10
0.80
1.2
Vdc
Reverse Recovery Time
(I
30 Ad
V
0Vd
trr
30
ns
(IS = 30 Adc, VGS = 0 Vdc,
dIS/dt = 100 A/µs) (Note 3)
ta
14.5
dIS/dt = 100 A/µs) (Note 3)
tb
15.5
Reverse Recovery Stored Charge
QRR
0.013
mC
3. Pulse Test: Pulse Width
≤ 300 µs, Duty Cycle ≤ 2%.
4. Switching characteristics are independent of operating junction temperatures.


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