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IS46TR81280ED-15HBLA2 Datasheet(PDF) 11 Page - Integrated Silicon Solution, Inc

Part # IS46TR81280ED-15HBLA2
Description  128MX8, 64MX16 1Gb DDR3 SDRAM WITH ECC
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Manufacturer  ISSI [Integrated Silicon Solution, Inc]
Direct Link  http://www.issi.com
Logo ISSI - Integrated Silicon Solution, Inc

IS46TR81280ED-15HBLA2 Datasheet(HTML) 11 Page - Integrated Silicon Solution, Inc

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IS43/46TR16640ED
IS43/46TR81280ED
Integrated Silicon Solution, Inc.
– www.issi.com –
11
Rev. 0B
08/08/2016
Write command via A12/BC#. Configuartion of BL4 or usage of BC4 may restrict the ECC Functionality. Please refer to
ECC Feature.
Burst
Length
READ/
WRITE
Starting
Column
ADDRESS
(A2,A1,A0)
burst type = Sequential
(decimal)
A3 = 0
burst type = Interleaved
(decimal)
A3 = 1
Notes
4
Chop
READ
0
0,1,2,3,T,T,T,T
0,1,2,3,T,T,T,T
1, 2, 3, 6
1
1,2,3,0,T,T,T,T
1,0,3,2,T,T,T,T
1, 2, 3, 6
10
2,3,0,1,T,T,T,T
2,3,0,1,T,T,T,T
1, 2, 3, 6
11
3,0,1,2,T,T,T,T
3,2,1,0,T,T,T,T
1, 2, 3, 6
100
4,5,6,7,T,T,T,T
4,5,6,7,T,T,T,T
1, 2, 3, 6
101
5,6,7,4,T,T,T,T
5,4,7,6,T,T,T,T
1, 2, 3, 6
110
6,7,4,5,T,T,T,T
6,7,4,5,T,T,T,T
1, 2, 3, 6
111
7,4,5,6,T,T,T,T
7,6,5,4,T,T,T,T
1, 2, 3, 6
WRITE
0,V,V
0,1,2,3,X,X,X,X
0,1,2,3,X,X,X,X
1, 2, 4, 5, 6
1,V,V
4,5,6,7,X,X,X,X
4,5,6,7,X,X,X,X
1, 2, 4, 5, 6
8
READ
0
0,1,2,3,4,5,6,7
0,1,2,3,4,5,6,7
2
1
1,2,3,0,5,6,7,4
1,0,3,2,5,4,7,6
2
10
2,3,0,1,6,7,4,5
2,3,0,1,6,7,4,5
2
11
3,0,1,2,7,4,5,6
3,2,1,0,7,6,5,4
2
100
4,5,6,7,0,1,2,3
4,5,6,7,0,1,2,3
2
101
5,6,7,4,1,2,3,0
5,4,7,6,1,0,3,2
2
110
6,7,4,5,2,3,0,1
6,7,4,5,2,3,0,1
2
111
7,4,5,6,3,0,1,2
7,6,5,4,3,2,1,0
2
WRITE
V,V,V
0,1,2,3,4,5,6,7
0,1,2,3,4,5,6,7
2, 4
Notes:
1. In case of burst length being fixed to 4 by MR0 setting, the internal write operation starts two clock cycles earlier than for the BL8 mode. This means
that the starting point for tWR and tWTR will be pulled in by two clocks. In case of burst length being selected on-the-fly via A12/BC#, the internal
write operation starts at the same point in time like a burst of 8 write operation. This means that during on-the-fly control, the starting point for tWR
and tWTR will not be pulled in by two clocks.
2. 0...7 bit number is value of CA[2:0] that causes this bit to be the first read during a burst.
3. T: Output driver for data and strobes are in high impedance.
4. V: a valid logic level (0 or 1), but respective buffer input ignores level on input pins.
5.
X: Don’t Care.
6. Use of this burst length may restrict ECC functionality
2.3.2.2 CAS Latency
The CAS Latency is defined by MR0 (bits A9-A11) as shown in Figure 2.3.2. CAS Latency is the delay, in clock cycles,
between the internal Read command and the availability of the first bit of output data. DDR3 SDRAM does not support
any half-clock latencies. The overall Read Latency (RL) is defined as Additive Latency (AL) + CAS Latency (CL); RL = AL
+ CL. For more information on the supported CL and AL settings based on the operating clock frequency, refer to
“Standard Speed Bins”.
2.3.2.3 Test Mode
The normal operating mode is selected by MR0 (bit A7 = 0) and all other bits set to the desired values shown in Figure
2.3.2
. Programming bit A7 to a ‘1’ places the DDR3 SDRAM into a test mode that is only used by the DRAM Manufacturer
and should NOT be used. No operations or functionality is specified if A7 = 1.
2.3.2.4 DLL Reset
The DLL Reset bit is self-
clearing, meaning that it returns back to the value of ‘0’ after the DLL reset function has been
issued. Once the DLL is enabled, a subsequent DLL Reset should be applied. Any time that the DLL reset function is
used, tDLLK must be met before any functions that require the DLL can be used (i.e., Read commands or ODT
synchronous operations).


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