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SN74LVC2G66 Datasheet(PDF) 1 Page - Texas Instruments |
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SN74LVC2G66 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 19 page www.ti.com FEATURES DCT OR DCU PACKAGE (TOP VIEW) 1 2 3 4 8 7 6 5 1A 1B 2C GND VCC 1C 2B 2A 4 3 2 1 5 6 7 8 GND 2C 1B 1A 2A 2B 1C VCC YEA, YEP, YZA, OR YZP PACKAGE (BOTTOM VIEW) DESCRIPTION/ORDERING INFORMATION SN74LVC2G66 DUAL BILATERAL ANALOG SWITCH SCES325H – JULY 2001 – REVISED JULY 2005 • Available in the Texas Instruments NanoStar™ and NanoFree™ Packages • 1.65-V to 5.5-V VCC Operation • Inputs Accept Voltages to 5.5 V • Max tpd of 0.8 ns at 3.3 V • High On-Off Output Voltage Ratio • High Degree of Linearity • High Speed, Typically 0.5 ns (VCC = 3 V, CL = 50 pF) • Rail-to-Rail Input/Output • Low On-State Resistance, Typically ≈6 Ω (VCC = 4.5 V) • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II This dual bilateral analog switch is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC2G66 can handle both analog and digital signals. The device permits signals with amplitudes of up to 5.5 V (peak) to be transmitted in either direction. NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. Each switch section has its own enable-input control (C). A high-level voltage applied to C turns on the associated switch section. Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoStar™ – WCSP (DSBGA) SN74LVC2G66YEAR 0.17-mm Small Bump – YEA NanoFree™ – WCSP (DSBGA) SN74LVC2G66YZAR 0.17-mm Small Bump – YZA (Pb-free) Reel of 3000 _ _ _C6_ NanoStar™ – WCSP (DSBGA) SN74LVC2G66YEPR 0.23-mm Large Bump – YEP –40°C to 85°C NanoFree™ – WCSP (DSBGA) SN74LVC2G66YZPR 0.23-mm Large Bump – YZP (Pb-free) SSOP – DCT Reel of 3000 SN74LVC2G66DCTR C66_ _ _ Reel of 3000 SN74LVC2G66DCUR VSSOP – DCU C66_ Reel of 250 SN74LVC2G66DCUT (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar, NanoFree are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2001–2005, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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