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SN74LVC2G66 Datasheet(PDF) 1 Page - Texas Instruments

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Part # SN74LVC2G66
Description  DUAL BILATERAL ANALOG SWITCH
Download  19 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

SN74LVC2G66 Datasheet(HTML) 1 Page - Texas Instruments

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FEATURES
DCT OR DCU PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
1A
1B
2C
GND
VCC
1C
2B
2A
4
3
2
1
5
6
7
8
GND
2C
1B
1A
2A
2B
1C
VCC
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
DESCRIPTION/ORDERING INFORMATION
SN74LVC2G66
DUAL BILATERAL ANALOG SWITCH
SCES325H – JULY 2001 – REVISED JULY 2005
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
1.65-V to 5.5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Max tpd of 0.8 ns at 3.3 V
High On-Off Output Voltage Ratio
High Degree of Linearity
High Speed, Typically 0.5 ns
(VCC = 3 V, CL = 50 pF)
Rail-to-Rail Input/Output
Low On-State Resistance, Typically
≈6 Ω
(VCC = 4.5 V)
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
This dual bilateral analog switch is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2G66 can handle both analog and digital signals. The device permits signals with amplitudes of up
to 5.5 V (peak) to be transmitted in either direction.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
Each switch section has its own enable-input control (C). A high-level voltage applied to C turns on the
associated switch section.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoStar™ – WCSP (DSBGA)
SN74LVC2G66YEAR
0.17-mm Small Bump – YEA
NanoFree™ – WCSP (DSBGA)
SN74LVC2G66YZAR
0.17-mm Small Bump – YZA (Pb-free)
Reel of 3000
_ _ _C6_
NanoStar™ – WCSP (DSBGA)
SN74LVC2G66YEPR
0.23-mm Large Bump – YEP
–40°C to 85°C
NanoFree™ – WCSP (DSBGA)
SN74LVC2G66YZPR
0.23-mm Large Bump – YZP (Pb-free)
SSOP – DCT
Reel of 3000
SN74LVC2G66DCTR
C66_ _ _
Reel of 3000
SN74LVC2G66DCUR
VSSOP – DCU
C66_
Reel of 250
SN74LVC2G66DCUT
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
• = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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