SN74LVC2G02

DUAL 2INPUT POSITIVENOR GATE

SCES194J − APRIL 1999 − REVISED SEPTEMBER 2003

1

POST OFFICE BOX 655303

NanoStar

 and NanoFree Packages

Operation

JESD 78, Class II

− 2000-V Human-Body Model (A114-A)

− 1000-V Charged-Device Model (C101)

description /ordering information

The SN74LVC2G02 performs the Boolean function Y = A + B or Y = A

• B in positive logic.

NanoStar

 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING‡

NanoStar

 − WCSP (DSBGA)

0.17-mm Small Bump − YEA

SN74LVC2G02YEAR

NanoFree

 − WCSP (DSBGA)

0.17-mm Small Bump − YZA (Pb-free)

Reel of 3000

SN74LVC2G02YZAR

_ _ _CB_

−40

°C to 85°C

NanoStar

 − WCSP (DSBGA)

0.23-mm Large Bump − YEP

Reel of 3000

SN74LVC2G02YEPR

_ _ _CB_

−40

°C to 85°C

NanoFree

 − WCSP (DSBGA)

0.23-mm Large Bump − YZP (Pb-free)

SN74LVC2G02YZPR

SSOP − DCT

Reel of 3000

SN74LVC2G02DCTR

C02_ _ _

VSSOP − DCU

Reel of 3000

SN74LVC2G02DCUR

C02_

VSSOP − DCU

Reel of 250

SN74LVC2G02DCUT

C02_

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

‡ DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,

and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition

(1 = SnPb,

Copyright

 2003, Texas Instruments Incorporated

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar and NanoFree are trademarks of Texas Instruments.

DCT OR DCU PACKAGE

(TOP VIEW)

1

2

3

4

8

7

6

5

1A

1B

2Y

GND

1Y

2B

2A

4

3

2

1

5

6

7

8

GND

2Y

1B

1A

2A

2B

1Y

YEA, YEP, YZA, OR YZP PACKAGE

(BOTTOM VIEW)

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.