NCP4681, NCP4684

http://onsemi.com

3

ABSOLUTE MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage (Note 1)

6.0

V

Output Voltage

V

Chip Enable Input

6.0

V

Output Current

180

mA

Power Dissipation XDFN0808

286

mW

Power Dissipation SC−70

380

Power Dissipation SOT23

420

Junction Temperature

−40 to 150

°C

Storage Temperature

−55 to 125

°C

ESD Capability, Human Body Model (Note 2)

2000

V

ESD Capability, Machine Model (Note 2)

200

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)

ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)

Latch−up Current Maximum Rating tested per JEDEC standard: JESD78.

THERMAL CHARACTERISTICS

Rating

Symbol

Value

Unit

Thermal Characteristics, XDFN 0.8 x 0.8 mm

Thermal Resistance, Junction−to−Air

350

°C/W

Thermal Characteristics, SOT23

Thermal Resistance, Junction−to−Air

238

°C/W

Thermal Characteristics, SC−70

Thermal Resistance, Junction−to−Air

263

°C/W