NCS2003/A, NCV2003, NCS20032, NCV20032, NCS20034, NCV20034

www.onsemi.com

3

ABSOLUTE MAXIMUM RATINGS

Over operating free−air temperature, unless otherwise stated

Parameter

Symbol

Limit

Unit

7.0

V

INPUT AND OUTPUT PINS

Input Voltage (Note 1)

V

Input Current

10

mA

Output Short Current (Note 2)

100

mA

TEMPERATURE

Storage Temperature

−65 to 150

°C

Junction Temperature

150

°C

ESD RATINGS (Note 3)

Human Body Model

NCx2003, A

NCx20032

NCx20034

HBM

3000

2000

3000

V

Machine Model

NCx2003, A

NCx20032

NCx20034

MM

200

100

150

V

Charged Device Model

NCx2003, A

NCx2003x

CDM

1000

2000

V

OTHER PARAMETERS

Moisture Sensitivity Level (Note 5)

MSL

Level 1

Latch−up Current (Note 4)

100

mA

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

2. Indefinite duration; however, maximum package power dissipation limits must be observed to ensure that the maximum junction temperature

is not exceeded.

3. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per AEC−Q100−002 and JESD22−A114

ESD Machine Model tested per AEC−Q100−003 and JESD22−A115

ESD Charged Device Model tested per AEC−Q100−011 and ANSI/ESD S5.3.1−2009

4. Latch−up current tested per JEDEC Standard JESD78.

5. Moisture Sensitivity Level tested per IPC/JEDEC standard J−STD−020A.

THERMAL INFORMATION

Thermal Metric

Symbol

Package

Single Layer Board (Note 6)

Multi Layer Board (Note 7)

Unit

Junction to Ambient

Thermal Resistance

SOT23−5/TSOP−5

408

355

°C/W

SOT553−5

428

406

Micro8/MSOP8

235

163

SOIC−8

240

179

TSSOP−8

300

238

SOIC−14

167

123

RECOMMENDED OPERATING CONDITIONS

Parameter

Symbol

Min

Max

Unit

1.7

5.5

V

Specified Operating Range

NCS2003, A

NCV2003, NCx20032, NCx20034

−40

−40

+85

+125

°C

Input Common Mode Range

V

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.