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MC100EL11DG Datasheet(PDF) 2 Page - ON Semiconductor

Part # MC100EL11DG
Description  5.0V ECL 1:2 Differential Fanout Buffer
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MC100EL11DG Datasheet(HTML) 2 Page - ON Semiconductor

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MC10EL11, MC100EL11
www.onsemi.com
2
Table 2. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
75 KW
Internal Input Pullup Resistor
N/A
ESD Protection
Human Body Model
Machine Model
> 1 KV
> 100 V
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Pb-Free Pkg
SOIC−8
TSSOP−8
Level 1
Level 3
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count
44
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
8
V
VEE
NECL Mode Power Supply
VCC = 0 V
−8
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI ≤ VCC
VI ≥ VEE
6
−6
V
Iout
Output Current
Continuous
Surge
50
100
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction-to-Ambient)
0 lfpm
500 lfpm
SOIC−8
190
130
°C/W
qJC
Thermal Resistance (Junction-to-Case)
Standard Board
SOIC−8
41 to 44
°C/W
qJA
Thermal Resistance (Junction-to-Ambient)
0 lfpm
500 lfpm
TSSOP−8
185
140
°C/W
qJC
Thermal Resistance (Junction-to-Case)
Standard Board
TSSOP−8
41 to 44 ± 5%
°C/W
Tsol
Wave Solder (Pb-Free)
<2 to 3 sec @ 260°C
265
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)


Similar Part No. - MC100EL11DG

ManufacturerPart #DatasheetDescription
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ON Semiconductor
MC100EL11DG ONSEMI-MC100EL11DG Datasheet
150Kb / 9P
   5.0 V ECL 1:2 Differential Fanout Buffer
December, 2006??Rev. 9
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