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OMAP3525EZCBC Datasheet(PDF) 4 Page - Texas Instruments |
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OMAP3525EZCBC Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 262 page  OMAP3525-HiRel, OMAP3530-HiRel SPRS599D – JUNE 2009 – REVISED AUGUST 2010 www.ti.com 1.2 Description OMAP3525 and OMAP3530 high-performance, applications processors are based on the enhanced OMAP™ 3 architecture. The OMAP™ 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following: • Streaming video • 3D mobile gaming • Video conferencing • High-resolution still image The device supports high-level operating systems (OSs), such as: • Linux • Windows CE This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products. The following subsystems are part of the device: • Microprocessor unit (MPU) subsystem based on the ARM Cortex™-A8 microprocessor • IVA2.2 subsystem with a C64x+ digital signal processor (DSP) core • POWERVR SGX™ subsystem for 3D graphics acceleration to support display and gaming effects (3530 only) • Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors • Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC/PAL video out. • Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals The device also offers: • A comprehensive power and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex™ adaptative voltage control. This power management technique for automatic control of the operating voltage of a module reduces the active power consumption. • Memory stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only) OMAP25 and OMAP3530 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages are not available in the CUS package. Table 1-1 lists the differences between the CBB, CBC, and CUS packages. 4 OMAP3525-HiRel and OMAP3530-HiRel Applications Processor Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): OMAP3525-HiRel OMAP3530-HiRel |
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